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CD54AC74F3A

Texas Instruments

CD54AC74F3A by Texas Instruments

CD54AC74F3A by Texas Instruments is a CMOS latches & flip-flops IC with 2 functions, 14ns propagation delay at 3.3V supply voltage. It operates b/w -55 to 125°C, has a max frequency of 79MHz, and is ideal for military-grade applications requiring positive edge triggering in a ceramic package.

Median Price

$8.030

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 72 parts In-Stock

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$8.030

100+ parts

$7.870

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$7.710

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$8.030

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$7.710

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Freelance Electronics

USA . 60 parts In-Stock

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$2.839

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$2.981

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$2.811

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$2.811

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Bristol Electronics

USA . 23 parts In-Stock

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$6.720

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$3.360

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Digiode

USA . 396 parts In-Stock

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$12.208

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Forefront Electronics and Design

USA . 29 parts In-Stock

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$49.000

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Vyrian

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Manoshevitz Elec. Sales

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Corel Iberica Componentes, S.L.

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Speed Components Ltd

Israel . 68 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 30 parts In-Stock

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Rebound Electronics

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ECAB

Sweden . 16 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 10 parts In-Stock

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Holdelec - ElecDif-Pro

France . 10 parts In-Stock

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Electronics Depot

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Electronic Expediters

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North Shore Components

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LWI Electronics Inc

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Distributors (Availability)

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Native Components

USA . 126 parts In-Stock

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$0.209

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$0.201

126

$0.209

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$0.201

Northwest PG Solutions

USA . 842 parts In-Stock

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$0.230

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$0.203

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$0.230

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Corphita

USA . 1,158 parts In-Stock

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$11.565

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Parana Technologies

USA . 2,311 parts In-Stock

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$22.652

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$23.308

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DigiPath Technology Company

USA . 976 parts In-Stock

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$24.943

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$22.948

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ChromeModa Solutions

Germany . 3,153 parts In-Stock

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$25.452

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$20.871

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IDEA Electronic Components Group

UK . 1,732 parts In-Stock

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$25.452

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$24.179

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$22.907

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Microchip USA

USA . 2,511 parts In-Stock

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$32.900

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$32.430

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$32.200

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$31.960

2,511

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Supply Digital

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Assy Fe

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Perfect Parts

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Overview

Enhance your electronic designs with the CD54AC74F3A by Texas Instruments, a top-of-the-line latches & flip-flops component that boasts superior quality and reliability. Trusted by engineers worldwide, Texas Instruments delivers exceptional products that excel in performance and durability. Perfect for a wide range of applications, this versatile component offers unmatched value and benefits to customers looking to elevate their projects. Experience seamless operation and efficiency with the CD54AC74F3A, the ultimate choice for your electronic needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material ensures durability and reliability in various operating conditions.

Propagation Delay At Nominal Supply: 14 ns

Low propagation delay ensures fast response times, making this product suitable for high-speed applications.

No. of Functions: 2

Having 2 functions in one component provides added functionality and can help simplify circuit design.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage of 3.3V, making it compatible with a wide range of systems.

Trigger Type: POSITIVE EDGE

Positive edge trigger type ensures reliable and precise operation in digital circuits.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Latches & Flip-Flops CD54AC74F3A attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AC

JESD-30 Code:

R-GDIP-T14

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

79000000 Hz

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

14 ns

Propagation Delay (tpd):

125 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

110 MHz

Trade Compliance

CD54AC74F3A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-354-6167, 5962013546167, 5962-01-412-2887, 5962014122887

NIIN

013546167, 014122887

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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