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CD54ACT112H

Texas Instruments

CD54ACT112H by Texas Instruments

CD54ACT112H by Texas Instruments is a CMOS latches & flip-flops chip with 2 functions and 2 bits. It operates at a supply voltage range of 4.5V to 5.5V, has a propagation delay of 10.3ns, and supports a max frequency of 100MHz. Ideal for military-grade applications requiring negative edge triggering in temperatures ranging from -55°C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,555 parts In-Stock

1+ parts

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3,555

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Vyrian

USA . 3,135 parts In-Stock

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3,135

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 681 parts In-Stock

1+ parts

$0.075

100+ parts

-

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$0.072

681

$0.075

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$0.072

Northwest PG Solutions

USA . 1,609 parts In-Stock

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$0.083

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-

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$0.073

1,609

$0.083

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$0.073

AZTECH Wire

Italy . 249 parts In-Stock

1+ parts

$7.684

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249

$7.684

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Parana Technologies

USA . 1,410 parts In-Stock

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$18.890

100+ parts

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$18.965

10k+ parts

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1,410

$18.890

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$18.965

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ChromeModa Solutions

Germany . 2,783 parts In-Stock

1+ parts

$21.225

100+ parts

$17.404

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2,783

$21.225

$17.404

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IDEA Electronic Components Group

UK . 2,208 parts In-Stock

1+ parts

$21.225

100+ parts

$20.164

1k+ parts

$19.102

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2,208

$21.225

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$19.102

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One Stop Electronics

USA . 1,632 parts In-Stock

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$30.000

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1,632

$30.000

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DigiPath Technology Company

USA . 2,118 parts In-Stock

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$19.136

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2,118

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$19.136

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Corphita

USA . 183 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the CD54ACT112H by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality latches & flip-flops that guarantee reliability and performance. Ideal for a wide range of applications, this versatile product offers customers unmatched value and benefits. Trust Texas Instruments to provide you with innovative solutions that meet your needs and exceed your expectations. Elevate your projects with the CD54ACT112H today.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and facilitating automated assembly processes.

No. of Functions: 2

Provides flexibility in functionality and can be used for multiple purposes within a circuit.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard power supply voltages, making it easy to integrate into existing systems.

Propagation Delay (tpd): 10.3 ns

Ensures fast response times, making it suitable for high-speed applications.

Trigger Type: NEGATIVE EDGE

Allows for precise triggering and control of the latch or flip-flop.

Output Polarity: COMPLEMENTARY

Offers flexibility in signal processing and can be easily integrated with other components in the circuit.

Temperature Grade: MILITARY

Designed to withstand extreme temperature conditions, making it suitable for harsh environments such as military applications.

Technology: CMOS

Ensures low power consumption and compatibility with a wide range of digital systems.

Technical Specifications

Latches & Flip-Flops CD54ACT112H attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

ACT

JESD-30 Code:

X-XUUC-N

Logic IC Type:

No. of Bits:

2

No. of Functions:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

UNCASED CHIP

Propagation Delay (tpd):

10.3 ns

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trigger Type:

NEGATIVE EDGE

Minimum fmax:

100 MHz

Trade Compliance

CD54ACT112H Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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