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CD54AC109H

Texas Instruments

CD54AC109H by Texas Instruments

CD54AC109H by Texas Instruments is a CMOS latch with 2 functions and bits, operating at 3.3V. It has a propagation delay of 129ns, suitable for military-grade applications due to its wide temperature range (-55 to 125°C) and high max supply voltage of 5.5V.

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Vyrian

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Digiode

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AZTECH Wire

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Parana Technologies

USA . 834 parts In-Stock

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$18.076

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$1,678.622

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$16.268

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Native Components

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DigiPath Technology Company

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Northwest PG Solutions

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ChromeModa Solutions

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IDEA Electronic Components Group

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One Stop Electronics

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Supply Digital

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Overview

Enhance your electronic projects with the Texas Instruments CD54AC109H, a high-quality latches and flip-flops component designed to deliver reliable performance. Manufactured by Texas Instruments, known for their top-notch products, this versatile chip offers 2 functions and 2 bits for seamless integration into various applications. With a nominal supply voltage of 3.3V and a wide temperature range, this product is perfect for military-grade projects requiring fast propagation delay and high-speed operation up to 100 MHz. Trust in Texas Instruments for cutting-edge technology and unparalleled value in every design.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and reliable installation on circuit boards, making this latch or flip-flop convenient for PCB assembly.

No. of Functions: 2

With 2 separate functions, this latch or flip-flop can perform multiple tasks simultaneously, increasing its versatility.

No. of Bits: 2

Having 2 bits allows for more complex operations and storage of data, making this product suitable for applications requiring higher resolution.

Nominal Supply Voltage: 3.3V

Operating at 3.3V makes this latch or flip-flop compatible with many common electronic systems, offering flexibility in integration.

Package Style: UNCASED CHIP

The unencased chip package style offers a compact design, saving space on the PCB and enabling efficient utilization of board real estate.

Propagation Delay: 129 ns

With a fast propagation delay, this latch or flip-flop can quickly respond to input changes, ensuring timely and accurate signal processing.

Maximum Operating Temperature: 125°C

The high maximum operating temperature allows this latch or flip-flop to function reliably in demanding environments with elevated temperatures.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures precise timing control, enabling synchronized operations with other components in the system.

Minimum Operating Temperature: -55°C

The low minimum operating temperature range enables this latch or flip-flop to operate in cold environments without compromising performance.

Terminal Position: UPPER

The upper terminal position facilitates easy connection and routing of signals, simplifying the design and assembly process.

Output Polarity: COMPLEMENTARY

The complementary output polarity provides flexibility in signal representation and processing, offering different logic options for diverse applications.

Minimum Supply Voltage: 1.5V

Supporting a minimum supply voltage of 1.5V allows this latch or flip-flop to operate in low power environments, conserving energy and extending battery life.

Technology: CMOS

Utilizing CMOS technology ensures efficient power consumption and high noise immunity, making this latch or flip-flop suitable for various electronic designs.

Terminal Form: NO LEAD

The no lead terminal form simplifies the installation and maintenance process, reducing the risk of solder joint failures and enhancing product reliability.

Minimum fmax: 100 MHz

With a minimum fmax of 100 MHz, this latch or flip-flop can operate at high frequencies, enabling rapid data processing and communication in complex systems.

Maximum Supply Voltage: 5.5V

Supporting a maximum supply voltage of 5.5V ensures compatibility with a wide range of voltage sources, offering flexibility in system integration and operation.

Technical Specifications

Latches & Flip-Flops CD54AC109H attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AC

JESD-30 Code:

X-XUUC-N

Logic IC Type:

No. of Bits:

2

No. of Functions:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

UNCASED CHIP

Propagation Delay (tpd):

129 ns

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trigger Type:

POSITIVE EDGE

Minimum fmax:

100 MHz

Trade Compliance

CD54AC109H Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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