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CD54AC273F3A96

Texas Instruments

CD54AC273F3A96 by Texas Instruments

CD54AC273F3A96 by Texas Instruments is an 8-bit latch with a propagation delay of 169ns. It operates b/w -55 to 125°C, suitable for military-grade applications. With a supply voltage range of 1.5V to 5.5V, it offers true output polarity and positive edge triggering in a ceramic package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,125 parts In-Stock

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Vyrian

USA . 4,081 parts In-Stock

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4,081

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Distributors (Availability)

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AZTECH Wire

Italy . 530 parts In-Stock

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$8.250

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530

$8.250

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Parana Technologies

USA . 2,047 parts In-Stock

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$29.836

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$2,770.759

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$26.853

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2,047

$29.836

$2,770.759

$26.853

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DigiPath Technology Company

USA . 1,891 parts In-Stock

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$32.854

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$30.225

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$32.854

$30.225

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IDEA Electronic Components Group

UK . 2,121 parts In-Stock

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$33.524

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$31.848

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$30.172

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2,121

$33.524

$31.848

$30.172

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ChromeModa Solutions

Germany . 985 parts In-Stock

1+ parts

$33.524

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$27.490

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985

$33.524

$27.490

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Native Components

USA . 739 parts In-Stock

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$47.170

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$45.283

739

$47.170

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$45.283

Northwest PG Solutions

USA . 2,242 parts In-Stock

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$51.887

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$51.887

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One Stop Electronics

USA . 442 parts In-Stock

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$63.000

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Corphita

USA . 2,966 parts In-Stock

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Overview

Discover the superior quality and reliability of the CD54AC273F3A96 by Texas Instruments, a leading manufacturer in the industry. This versatile latch & flip-flop device offers seamless operation and precision with its ceramic, glass-sealed package body material. Ideal for military-grade applications, this product ensures optimal performance even in extreme conditions. Experience the value and benefits of this innovative technology, providing customers with efficient solutions for their circuit design needs. Trust Texas Instruments for top-notch products that deliver exceptional results every time.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection for the internal components, ensuring a longer lifespan for the latch or flip-flop.

Nominal Supply Voltage: 3.3V

Operates at a commonly used voltage level, making it compatible with a wide range of electronic devices.

Propagation Delay: 169 ns

Low propagation delay ensures fast and efficient operation of the latch or flip-flop.

Trigger Type: POSITIVE EDGE

Positive edge triggering allows for precise control over when the latch or flip-flop changes state, ideal for timing-sensitive applications.

Temperature Grade: MILITARY

Designed to operate in harsh environments, making it suitable for military or aerospace applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Latches & Flip-Flops CD54AC273F3A96 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

LG-MAX

Family:

AC

JESD-30 Code:

R-GDIP-T20

Length:

26.92 mm

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

169 ns

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

100 MHz

Trade Compliance

CD54AC273F3A96 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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