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SN74LVC1G79DBVT

Texas Instruments

SN74LVC1G79DBVT by Texas Instruments

SN74LVC1G79DBVT by Texas Instruments is a CMOS latch with 5 ns propagation delay, suitable for automotive applications. It operates at 1.8V nominal voltage and supports a max frequency of 160 MHz. With a small outline package style and low profile design, it is ideal for surface mount PCBs in tight spaces.

Median Price

$0.502

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 36 parts In-Stock

1+ parts

$0.339

100+ parts

$0.339

1k+ parts

-

10k+ parts

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36

$0.339

$0.339

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-

Texas Instruments

USA . 55,095 parts In-Stock

1+ parts

$0.775

100+ parts

$0.527

1k+ parts

$0.270

10k+ parts

-

55,095

$0.775

$0.527

$0.270

-

Mouser Electronics

USA . 717 parts In-Stock

1+ parts

$0.870

100+ parts

$0.491

1k+ parts

$0.411

10k+ parts

$0.392

717

$0.870

$0.491

$0.411

$0.392

Rochester

USA . 123,518 parts In-Stock

1+ parts

-

100+ parts

$0.484

1k+ parts

$0.402

10k+ parts

$0.358

123,518

-

$0.484

$0.402

$0.358

DigiKey

USA . 123,518 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.600

10k+ parts

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123,518

-

-

$0.600

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Verical

USA . 76,000 parts In-Stock

1+ parts

-

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$0.502

10k+ parts

$0.448

76,000

-

-

$0.502

$0.448

Chip1Stop

Japan . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.444

10k+ parts

-

250

-

-

$0.444

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,923 parts In-Stock

1+ parts

$0.356

100+ parts

-

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-

10k+ parts

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2,923

$0.356

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-

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TME

Poland . 115 parts In-Stock

1+ parts

$0.670

100+ parts

$0.519

1k+ parts

-

10k+ parts

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115

$0.670

$0.519

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-

Chip Stock

USA . 148,283 parts In-Stock

1+ parts

-

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148,283

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DigiKey Marketplace

USA . 123,518 parts In-Stock

1+ parts

-

100+ parts

$0.390

1k+ parts

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123,518

-

$0.390

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Vyrian

USA . 42,237 parts In-Stock

1+ parts

-

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42,237

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Semicontronic

India . 42,262 parts In-Stock

1+ parts

$0.319

100+ parts

$0.311

1k+ parts

$0.309

10k+ parts

-

42,262

$0.319

$0.311

$0.309

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Ampacity Inc.

Singapore . 42,123 parts In-Stock

1+ parts

$0.319

100+ parts

-

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42,123

$0.319

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-

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Corphita

USA . 638 parts In-Stock

1+ parts

$0.338

100+ parts

-

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638

$0.338

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Parana Technologies

USA . 200 parts In-Stock

1+ parts

$18.990

100+ parts

-

1k+ parts

$19.049

10k+ parts

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200

$18.990

-

$19.049

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DigiPath Technology Company

USA . 2,341 parts In-Stock

1+ parts

$20.910

100+ parts

$19.237

1k+ parts

-

10k+ parts

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2,341

$20.910

$19.237

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ChromeModa Solutions

Germany . 5,983 parts In-Stock

1+ parts

$21.337

100+ parts

$17.496

1k+ parts

-

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5,983

$21.337

$17.496

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IDEA Electronic Components Group

UK . 1,649 parts In-Stock

1+ parts

$21.337

100+ parts

$20.270

1k+ parts

$19.203

10k+ parts

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1,649

$21.337

$20.270

$19.203

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Corohmni

South Africa . 23 parts In-Stock

1+ parts

$28.146

100+ parts

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23

$28.146

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Perfect Parts

USA . 12,084 parts In-Stock

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12,084

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Argo Parts USA

USA . 594 parts In-Stock

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594

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Unlock the possibilities with the SN74LVC1G79DBVT by Texas Instruments. Crafted with precision and excellence, this latches & flip-flops device offers unparalleled performance and reliability. Ideal for a variety of applications, this product boasts a nominal supply voltage of 1.8V and a maximum operating temperature of 125°C, making it suitable for automotive use as well. With a compact design and high-speed operation, this product provides value and efficiency to customers looking for cutting-edge solutions in electronics. Choose Texas Instruments for top-notch quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and resistance to environmental conditions, making this latch suitable for various applications.

Propagation Delay At Nominal Supply: 5 ns

Fast propagation delay allows for quick response times, ideal for high-speed applications.

Surface Mount: YES

Surface mount capability makes installation easier and more efficient, saving time and effort during production.

Package Shape: RECTANGULAR

Rectangular shape provides easy integration into circuit designs and ensures compatibility with standard PCB layouts.

Nominal Supply Voltage / Vsup (V): 1.8

Low nominal supply voltage enables energy-efficient operation and compatibility with lower power systems.

Load Capacitance (CL): 50 pF

Suitable load capacitance for stable operation and minimal signal distortion in the circuit.

Power Supplies (V): 3.3

Operates efficiently at a common power supply voltage, ensuring compatibility with a wide range of electronic devices.

No. of Terminals: 5

Five terminals provide necessary connections for versatile use and flexibility in circuit configurations.

Maximum I (ol): 32 Amp

High maximum output current capability allows for driving power-hungry loads or multiple devices without risk of damaging the latch.

Propagation Delay (tpd): 20.5 ns

Reasonable propagation delay ensures reliable signal processing and accurate data transmission within the circuit.

Maximum Operating Temperature: 125 °C

Wide temperature range for operation makes this latch suitable for automotive and industrial applications subjected to varying environmental conditions.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, enabling multiple devices to be connected without interference to the signal line.

Trigger Type: POSITIVE EDGE

Positive edge trigger ensures precise timing and synchronization of data transfer in the latch.

Minimum Operating Temperature: -40 °C

Wide temperature range for operation makes this latch suitable for automotive and industrial applications subjected to varying environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish ensures reliable electrical connections and resistance to corrosion, extending the lifespan of the latch.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting options and compatibility with different PCB layouts.

Maximum Seated Height: 1.45 mm

Low profile design enables compact and efficient integration into electronic systems with limited space.

Width: 1.6 mm

Compact width size allows for space-saving installation and efficient use of PCB real estate.

Output Polarity: TRUE

True output polarity ensures consistent signal processing and compatibility with other components in the circuit.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage requirement enables operation in low-power applications and extends battery life.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance ensures reliable soldering during manufacturing processes without risk of damage to the latch.

Length: 2.9 mm

Compact length size enables efficient placement on PCBs and saves space in electronic assemblies.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance ensures reliability in harsh environments and automotive applications.

Maximum Frequency At Nominal Supply: 160000000 Hz

High maximum frequency capability allows for high-speed signal processing and data transfer in the circuit.

Technology: CMOS

CMOS technology provides low power consumption and compatibility with modern electronic systems.

Terminal Form: GULL WING

Gull wing terminal form enables easy soldering and connection to the PCB, ensuring reliable electrical connections.

Packing Method: TR

Tape and reel packing method provides convenience for automated assembly processes and protects the latch during transportation.

Terminal Pitch: 0.95 mm

Narrow terminal pitch allows for compact mounting on PCBs and efficient use of space in electronic systems.

Minimum fmax: 160 MHz

High minimum fmax frequency ensures high-speed performance and reliable signal processing in the latch.

Maximum Supply Voltage (Vsup): 5.5 V

Wide maximum supply voltage range ensures compatibility with different power sources and electronic systems.

Maximum Power Supply Current (ICC): 0.01 mA

Low power supply current consumption ensures energy efficiency and minimizes heat dissipation in the latch.

Technical Specifications

Latches & Flip-Flops SN74LVC1G79DBVT attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

160000000 Hz

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5 ns

Propagation Delay (tpd):

20.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

1.6 mm

Minimum fmax:

160 MHz

Trade Compliance

SN74LVC1G79DBVT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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