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CD54ACT273F3A

Texas Instruments

CD54ACT273F3A by Texas Instruments

CD54ACT273F3A by Texas Instruments is an 8-bit latch with 13.5 ns propagation delay at 5V, ideal for military applications. It features a max frequency of 85 MHz and operates b/w -55 to 125°C, making it suitable for high-speed and rugged environments. The package style is in-line with through-hole terminal form and tin/lead finish.

Median Price

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Lifecycle Status

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9

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Vyrian

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PC Components Company LLC

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NAC Semi

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Bristol Electronics

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ComSIT Distribution GmbH

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Electronic Expediters

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R&J Components

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One Stop Electronics

USA . 562 parts In-Stock

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Native Components

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AZTECH Wire

Italy . 349 parts In-Stock

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Parana Technologies

USA . 1,439 parts In-Stock

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DigiPath Technology Company

USA . 380 parts In-Stock

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ChromeModa Solutions

Germany . 3,824 parts In-Stock

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IDEA Electronic Components Group

UK . 1,303 parts In-Stock

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Lixinc

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Glotronic Ltd.

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Northwest PG Solutions

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Overview

Experience unmatched performance and reliability with the CD54ACT273F3A by Texas Instruments, a leader in electronic components. This high-quality latch & flip-flop device boasts a ceramic, glass-sealed construction for durability and precision. Ideal for a wide range of applications, this product offers customers exceptional value with its fast propagation delay, low power consumption, and robust design. Trust Texas Instruments for cutting-edge technology that delivers superior results every time.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring longevity and reliability.

Propagation Delay At Nominal Supply: 13.5 ns

Offers fast response time, making this latch efficient for time-sensitive applications.

No. of Bits: 8

Suitable for applications requiring storage or manipulation of 8 bits of information.

Nominal Supply Voltage / Vsup (V): 5

Standard and commonly used supply voltage, ensuring compatibility with typical power sources.

Maximum Operating Temperature: 125 °C

Can operate effectively in high-temperature environments, suitable for various industrial applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing overall performance.

Technical Specifications

Latches & Flip-Flops CD54ACT273F3A attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

ACT

JESD-30 Code:

R-GDIP-T20

JESD-609 Code:

e0

Length:

24.195 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

85000000 Hz

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

13.5 ns

Propagation Delay (tpd):

13.5 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

85 MHz

Trade Compliance

CD54ACT273F3A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-397-0254, 5962013970254

NIIN

013970254

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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