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CD54AC109E

Texas Instruments

CD54AC109E by Texas Instruments

CD54AC109E by Texas Instruments is a dual latches & flip-flops IC with 16 terminals. It operates at temperatures ranging from -55°C to 125°C and supports power supplies of 3.3V/5V. With a max frequency of 71MHz, it is ideal for military-grade applications requiring positive edge triggering and a load capacitance of 50pF.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,990 parts In-Stock

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Digiode

USA . 3,786 parts In-Stock

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Northwest PG Solutions

USA . 1,605 parts In-Stock

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$2.951

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$2.951

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AZTECH Wire

Italy . 886 parts In-Stock

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$8.513

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Parana Technologies

USA . 431 parts In-Stock

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$21.074

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$21.326

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431

$21.074

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DigiPath Technology Company

USA . 349 parts In-Stock

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$23.205

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$21.349

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349

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ChromeModa Solutions

Germany . 4,100 parts In-Stock

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$23.679

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$19.417

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$23.679

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IDEA Electronic Components Group

UK . 1,400 parts In-Stock

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$23.679

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$22.495

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$21.311

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One Stop Electronics

USA . 221 parts In-Stock

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$51.000

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Corphita

USA . 3,961 parts In-Stock

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Native Components

USA . 316 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the CD54AC109E by Texas Instruments. This top-quality latches & flip-flops component offers reliability and precision, backed by the trusted manufacturer's reputation for excellence. Ideal for a wide range of applications, this product delivers exceptional value to customers seeking high-performance solutions. Upgrade your projects with the CD54AC109E and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are known for their durability and resistance to heat and chemicals, ensuring a long lifespan for the product.

No. of Functions: 2

Having 2 functions in one unit provides versatility and efficiency in circuit design, saving space and reducing the need for additional components.

Package Shape: RECTANGULAR

Rectangular shape makes it easier for integration into circuit boards and ensures a compact design for efficient use of space.

Load Capacitance (CL): 50 pF

With a low load capacitance, this product can operate efficiently with minimal interference from external components, ensuring reliable performance.

Power Supplies (V): 3.3/5

Compatible with common power supply voltages of 3.3V and 5V, making it versatile and easy to integrate into existing circuits.

No. of Terminals: 16

Having 16 terminals provides flexibility in connecting various components and allows for multiple input/output options, enhancing functionality.

Package Style (Meter): IN-LINE

In-line package style is user-friendly and easy to install, making it convenient for assembly and maintenance purposes.

Maximum I (ol): 12 Amp

High maximum output current of 12 Amp allows for handling of heavy loads, making it suitable for applications requiring robust performance.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product is suitable for use in a wide range of environmental conditions, ensuring reliability.

Trigger Type: POSITIVE EDGE

Positive edge trigger type ensures precise timing control and accurate signal processing, making it ideal for applications requiring synchronization.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature of -55°C, this product can withstand extreme cold conditions, making it suitable for a variety of environments.

Terminal Position: DUAL

Dual terminal position allows for flexibility in circuit design and connectivity options, enhancing compatibility with different types of components.

Minimum Supply Voltage (Vsup): 1.5 V

Low minimum supply voltage of 1.5V ensures efficient power consumption and compatibility with lower voltage systems, making it energy-efficient.

Temperature Grade: MILITARY

Military-grade temperature rating ensures high reliability and performance in harsh operating conditions, making it suitable for rugged applications.

Maximum Frequency At Nominal Supply: 71000000 Hz

High maximum frequency allows for fast signal processing and response times, making it suitable for high-speed applications that require precision timing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient operation and reliable performance in various applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure connections and easy soldering, ensuring stable signal transmission and durability in a wide range of applications.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54mm allows for easy integration with other components and compatibility with standard PCB layouts, facilitating seamless assembly.

Technical Specifications

Latches & Flip-Flops CD54AC109E attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

71000000 Hz

Maximum I (ol):

12 Amp

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Sub-Category:

FF/Latches

Minimum Supply Voltage (Vsup):

1.5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Trade Compliance

CD54AC109E Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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