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CD54AC109M

Texas Instruments

CD54AC109M by Texas Instruments

CD54AC109M by Texas Instruments is a dual-function latches & flip-flops IC with 16 terminals. It operates at temperatures ranging from -55 to 125°C and supports supply voltages of 1.5V to 5V. With a max frequency of 71MHz, it is ideal for military-grade applications requiring positive edge triggering in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,258 parts In-Stock

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4,258

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Digiode

USA . 636 parts In-Stock

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636

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Parana Technologies

USA . 1,106 parts In-Stock

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$12.856

100+ parts

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$13.333

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1,106

$12.856

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$13.333

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One Stop Electronics

USA . 744 parts In-Stock

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$13.000

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744

$13.000

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DigiPath Technology Company

USA . 1,370 parts In-Stock

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$14.156

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1,370

$14.156

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ChromeModa Solutions

Germany . 2,364 parts In-Stock

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$14.445

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$11.845

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2,364

$14.445

$11.845

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IDEA Electronic Components Group

UK . 1,505 parts In-Stock

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$14.445

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$13.723

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$13.000

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1,505

$14.445

$13.723

$13.000

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AZTECH Wire

Italy . 604 parts In-Stock

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$17.018

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604

$17.018

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Native Components

USA . 682 parts In-Stock

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$349.795

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$342.799

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$339.301

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$335.803

682

$349.795

$342.799

$339.301

$335.803

Northwest PG Solutions

USA . 994 parts In-Stock

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$384.775

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994

$384.775

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Corphita

USA . 2,426 parts In-Stock

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2,426

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Overview

Unlock limitless possibilities with the Texas Instruments CD54AC109M latches & flip-flops. Crafted with precision by a trusted manufacturer, this versatile component offers seamless integration and reliable performance in a wide range of applications. From industrial automation to consumer electronics, experience unparalleled quality and efficiency with this innovative product. Elevate your projects with the CD54AC109M and unleash the full potential of your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving space and simplifying assembly.

No. of Functions: 2

Having multiple functions in one component increases efficiency and reduces the need for additional components, saving cost and board space.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to handle and integrate into the circuit layout.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures optimal performance and compatibility with other components in the circuit.

Power Supplies (V): 3.3/5

Supporting multiple power supply options gives flexibility in design and compatibility with different systems.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and functionalities, increasing versatility and capability.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and makes for a compact overall design.

Maximum I (ol): 12 Amp

With a high maximum output current, the product can support heavy loads and provide reliable performance under demanding conditions.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the product can withstand elevated temperatures without degradation in performance.

Trigger Type: POSITIVE EDGE

Positive edge triggering allows for precise control and timing in signal processing applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature makes the product suitable for a wide range of environments, including industrial and automotive applications.

Terminal Position: DUAL

Dual terminal positions offer flexibility in mounting and connection options, accommodating various circuit layouts.

Minimum Supply Voltage (Vsup): 1.5 V

The low minimum supply voltage requirement enables compatibility with low-power systems and extends the product's range of applications.

Temperature Grade: MILITARY

With military-grade temperature specifications, the product can meet stringent performance requirements in harsh environments and critical applications.

Maximum Frequency At Nominal Supply: 71000000 Hz

High maximum frequency capability at nominal supply voltage ensures efficient signal processing and responsiveness in high-speed applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and reliable connections during assembly, ensuring robust electrical performance.

Terminal Pitch: 1.27 mm

The specified terminal pitch allows for precise alignment and soldering on standard PCBs, enhancing ease of installation and reliability.

Technical Specifications

Latches & Flip-Flops CD54AC109M attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

71000000 Hz

Maximum I (ol):

12 Amp

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Sub-Category:

FF/Latches

Minimum Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Trade Compliance

CD54AC109M Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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