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CD54AC112M

Texas Instruments

CD54AC112M by Texas Instruments

CD54AC112M by Texas Instruments is a dual-function latch with 16 terminals, operating at temperatures from -55 to 125°C. It has a load capacitance of 50 pF and can handle max frequency of 71 MHz. Ideal for military applications due to its CMOS technology and negative edge trigger type.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 8,254 parts In-Stock

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Digiode

USA . 4,904 parts In-Stock

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Native Components

USA . 578 parts In-Stock

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$7.275

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Parana Technologies

USA . 764 parts In-Stock

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$11.250

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$1,044.696

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$10.125

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764

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DigiPath Technology Company

USA . 2,166 parts In-Stock

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$12.387

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ChromeModa Solutions

Germany . 4,630 parts In-Stock

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$12.640

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$10.365

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IDEA Electronic Components Group

UK . 594 parts In-Stock

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$12.640

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$12.008

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$11.376

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AZTECH Wire

Italy . 610 parts In-Stock

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$13.028

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One Stop Electronics

USA . 351 parts In-Stock

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Corphita

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Northwest PG Solutions

USA . 223 parts In-Stock

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Overview

Elevate your circuit design with the CD54AC112M by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality latches & flip-flops like no other. This versatile component offers customers unparalleled value and benefits, making it ideal for a wide range of applications. From consumer electronics to industrial automation, this product ensures reliable performance and efficiency. Upgrade your projects today with the CD54AC112M and experience the difference TI technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material helps in making the latch & flip-flop lightweight and durable for long-term use.

Surface Mount: YES

The surface mount feature makes it easy to integrate this latch & flip-flop into compact electronic devices or circuit boards.

No. of Functions: 2

Having 2 functions allows for versatile and flexible usage in electronic applications, providing more control and functionality.

Package Shape: RECTANGULAR

The rectangular package shape simplifies the design and layout of the circuit board, making it easier to place and solder the latch & flip-flop.

Load Capacitance (CL): 50 pF

The low load capacitance of 50 pF ensures efficient and fast operation of the latch & flip-flop in various electronic circuits.

Power Supplies (V): 3.3/5

Supporting multiple power supplies of 3.3V and 5V makes this latch & flip-flop compatible with a wide range of electronic devices and systems.

No. of Terminals: 16

Having 16 terminals allows for easy connectivity to external components, enabling seamless integration into electronic circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it ideal for compact electronic devices with limited real estate.

Maximum I (ol): 12 Amp

With a maximum output current of 12 Amp, this latch & flip-flop can handle high-power applications without overheating or malfunctioning.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance even in harsh environmental conditions.

Trigger Type: NEGATIVE EDGE

The negative edge trigger type provides precise and accurate control over the latch & flip-flop operation, enhancing overall functionality.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C allows the latch & flip-flop to function effectively in cold environments without any issues.

Terminal Position: DUAL

The dual terminal position enhances the ease of installation and connectivity, making it convenient for engineers and technicians to work with this latch & flip-flop.

Minimum Supply Voltage (Vsup): 1.5 V

The low minimum supply voltage of 1.5V ensures energy-efficient operation and extends the battery life of electronic devices using this latch & flip-flop.

Temperature Grade: MILITARY

The military-grade temperature rating ensures ruggedness and reliability, making this latch & flip-flop suitable for use in demanding applications and environments.

Maximum Frequency At Nominal Supply: 71000000 Hz

Supporting a high maximum frequency of 71,000,000 Hz at nominal supply voltage enables fast and efficient data processing and signal transmission in electronic circuits.

Technology: CMOS

The CMOS technology used in this latch & flip-flop provides low power consumption, high noise immunity, and fast switching speeds for improved performance.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering onto the circuit board, ensuring secure and reliable connections for optimal functionality.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27 mm allows for high-density mounting of this latch & flip-flop on the circuit board, saving space and improving overall design efficiency.

Technical Specifications

Latches & Flip-Flops CD54AC112M attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

71000000 Hz

Maximum I (ol):

12 Amp

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Sub-Category:

FF/Latches

Minimum Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

NEGATIVE EDGE

Trade Compliance

CD54AC112M Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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