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CD54ACT109E

Texas Instruments

CD54ACT109E by Texas Instruments

CD54ACT109E by Texas Instruments is a dual-function latch & flip-flop with 16 terminals. It operates at a supply voltage of 5V, has a load capacitance of 50pF, and can handle a max frequency of 100MHz. Ideal for military applications due to its temperature grade and CMOS technology, it triggers on positive edge transitions.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,492 parts In-Stock

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Digiode

USA . 1,313 parts In-Stock

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Native Components

USA . 918 parts In-Stock

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$0.720

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918

$0.720

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Northwest PG Solutions

USA . 2,072 parts In-Stock

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$0.792

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$0.792

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AZTECH Wire

Italy . 238 parts In-Stock

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$14.369

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One Stop Electronics

USA . 1,611 parts In-Stock

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$15.000

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Parana Technologies

USA . 241 parts In-Stock

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$15.984

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$16.328

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241

$15.984

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DigiPath Technology Company

USA . 554 parts In-Stock

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$17.600

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554

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ChromeModa Solutions

Germany . 4,846 parts In-Stock

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$17.959

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$14.726

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IDEA Electronic Components Group

UK . 240 parts In-Stock

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$17.959

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$17.061

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$16.163

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Corphita

USA . 2,731 parts In-Stock

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Overview

Upgrade your electronics with the CD54ACT109E by Texas Instruments, a top-quality latch & flip-flop device perfect for various applications. Manufactured by industry leader Texas Instruments, this product offers unmatched reliability and performance. With its dual functions and positive edge trigger type, this component is a must-have for any project requiring precise timing and control. Experience the benefits of Texas Instruments technology with the CD54ACT109E today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the latch or flip-flop suitable for various applications.

No. of Functions: 2

Having 2 functions allows for more functionality and versatility in the circuit or system where this latch or flip-flop is used.

Nominal Supply Voltage / Vsup (V): 5

Operating at a 5V supply voltage is common in many electronics, making it compatible with a wide range of systems and devices.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this latch or flip-flop can withstand high-temperature environments without malfunctioning.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the latch or flip-flop energy efficient and reliable in noisy environments.

Maximum Frequency At Nominal Supply: 100000000 Hz

The high maximum frequency capability of 100,000,000Hz allows for fast operation and response times in the circuit or system.

Technical Specifications

Latches & Flip-Flops CD54ACT109E attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

100000000 Hz

Maximum I (ol):

24 Amp

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

FF/Latches

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Trade Compliance

CD54ACT109E Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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