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CD54ACT112F3A

Texas Instruments

CD54ACT112F3A by Texas Instruments

CD54ACT112F3A by Texas Instruments is a CMOS latches & flip-flops IC with 2 functions, 11.1 ns propagation delay, and 5V nominal voltage. Ideal for military applications due to its -55°C to 125°C operating temperature range and MIL screening level. Package style is in-line with ceramic, glass-sealed body material.

Median Price

$15.640

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 25 parts In-Stock

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-

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$15.640

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$15.090

10k+ parts

$14.700

25

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$15.640

$15.090

$14.700

Distributors (In-Stock)

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Freelance Electronics

USA . 61 parts In-Stock

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$7.225

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$7.586

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$7.153

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Vyrian

USA . 3,430 parts In-Stock

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Digiode

USA . 2,570 parts In-Stock

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Electronic Expediters

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Speed Components Ltd

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Sogenti Electronics

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PC Components Company LLC

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Bristol Electronics

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Connector Distribution Corp

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Right Parts Inc.

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LWI Electronics Inc

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Distributors (Availability)

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Native Components

USA . 288 parts In-Stock

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$1.907

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Northwest PG Solutions

USA . 676 parts In-Stock

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$2.098

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Parana Technologies

USA . 1,148 parts In-Stock

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$8.870

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$9.552

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DigiPath Technology Company

USA . 37 parts In-Stock

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$9.767

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$8.985

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ChromeModa Solutions

Germany . 5,936 parts In-Stock

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$9.966

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IDEA Electronic Components Group

UK . 210 parts In-Stock

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$9.966

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$9.468

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$8.969

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AZTECH Wire

Italy . 672 parts In-Stock

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$14.996

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One Stop Electronics

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Microchip USA

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Corphita

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Supply Digital

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Kepictronics

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Overview

Elevate your electronics projects with the CD54ACT112F3A by Texas Instruments, a top-tier manufacturer known for superior quality and reliability. As a versatile latches & flip-flops component, this product offers fast propagation delay and precise trigger type, making it ideal for a variety of applications. With Texas Instruments' reputation for excellence, customers can trust in the value and benefits that this product brings to their designs. Experience seamless integration and high performance with the CD54ACT112F3A, setting new standards in electronic components.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides excellent protection and durability, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 11.1 ns

Fast propagation delay ensures quick response time, suitable for high-speed applications.

No. of Functions: 2

Having multiple functions in one device saves space and simplifies circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, compatible with many systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Maximum Frequency At Nominal Supply: 100000000 Hz

Capable of handling high-frequency signals, ideal for demanding applications.

Technical Specifications

Latches & Flip-Flops CD54ACT112F3A attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

ACT

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

100000000 Hz

Maximum I (ol):

-24 Amp

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

11.1 ns

Propagation Delay (tpd):

10.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

NEGATIVE EDGE

Width:

6.92 mm

Minimum fmax:

100 MHz

Trade Compliance

CD54ACT112F3A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-340-1510, 5962013401510, 5962-01-663-6249, 5962016636249

NIIN

013401510, 016636249

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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