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CD74HC273E

Texas Instruments

CD74HC273E by Texas Instruments

CD74HC273E by Texas Instruments is an 8-bit latch with a propagation delay of 45ns. It operates at a supply voltage range of 2-6V and has a max frequency of 20MHz. Ideal for applications requiring positive edge triggering, such as military-grade electronics.

Median Price

$1.120

Lifecycle Status

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50

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1k+

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Arrow

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Farnell

UK . 2 parts In-Stock

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Chip1Stop

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Texas Instruments

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Mouser Electronics

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DigiKey

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Adafruit Industries

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TEDSS.com

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Forefront Electronics and Design

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Corohmni

South Africa . 170 parts In-Stock

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Continental Prestige Electronics

USA . 6,389 parts In-Stock

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Argo Parts USA

USA . 3,268 parts In-Stock

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$0.352

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Netroflash

USA . 100 parts In-Stock

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$0.363

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Semicontronic

India . 1,175 parts In-Stock

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$0.510

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$0.497

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$0.495

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Corphita

USA . 2,061 parts In-Stock

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Parana Technologies

USA . 262 parts In-Stock

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$18.174

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$18.314

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DigiPath Technology Company

USA . 1,085 parts In-Stock

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$20.012

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$18.411

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ChromeModa Solutions

Germany . 3,349 parts In-Stock

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$20.420

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$16.744

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IDEA Electronic Components Group

UK . 1,827 parts In-Stock

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$19.399

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Advanced Electronics

New Zealand . 60 parts In-Stock

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$23.256

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Perfect Parts

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iodParts Technologies Inc.

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Overview

Upgrade your electronics with the CD74HC273E by Texas Instruments, a top-of-the-line latch & flip-flop device that guarantees precision and reliability. With a reputation for excellence, Texas Instruments offers unparalleled quality in every product. This versatile component is perfect for a wide range of applications, providing seamless performance and efficiency. Trust in the value this product brings to your projects and experience the benefits of using a top-tier solution from a trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the latch, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 45 ns

Fast propagation delay allows for quick response times, making this latch suitable for high-speed applications.

No. of Bits: 8

8 bits allow for a wide range of possible configurations and options for controlling various functions.

Nominal Supply Voltage / Vsup (V): 4.5

Compatible with a standard 4.5V supply voltage, making it easy to integrate into existing systems.

Trigger Type: POSITIVE EDGE

Positive edge triggering ensures precise and reliable signal detection, reducing the risk of errors.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this latch energy-efficient and reliable.

Temperature Grade: MILITARY

Designed to operate in extreme temperature conditions, making it suitable for military or industrial applications.

Technical Specifications

Latches & Flip-Flops CD74HC273E attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e4

Length:

25.4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

5.2 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

45 ns

Propagation Delay (tpd):

225 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

23 MHz

Trade Compliance

CD74HC273E Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-367-6021, 5962013676021, 5962-99-322-2846, 5962993222846

NIIN

013676021, 993222846

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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