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CC2530F32RHAR

Texas Instruments

CC2530F32RHAR by Texas Instruments

CC2530F32RHAR by Texas Instruments is a 40-terminal telecom IC with a 3V supply voltage. It operates b/w -40 to 125°C, suitable for automotive applications. This chip carrier has a square shape, measures 6x6mm, and is surface-mountable with nickel palladium gold finish.

Median Price

$3.491

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 25,175 parts In-Stock

1+ parts

$3.491

100+ parts

$3.059

1k+ parts

$1.728

10k+ parts

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25,175

$3.491

$3.059

$1.728

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,845 parts In-Stock

1+ parts

$3.316

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3,845

$3.316

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Vyrian

USA . 8,023 parts In-Stock

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8,023

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Cyclops Electronics Ltd

UK . 2,098 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 98 parts In-Stock

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$1.033

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98

$1.033

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Northwest PG Solutions

USA . 511 parts In-Stock

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$1.137

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511

$1.137

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Corphita

USA . 3,666 parts In-Stock

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$3.142

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$3.142

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Parana Technologies

USA . 877 parts In-Stock

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$10.691

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$11.180

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877

$10.691

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$11.180

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DigiPath Technology Company

USA . 2,148 parts In-Stock

1+ parts

$11.772

100+ parts

$10.830

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2,148

$11.772

$10.830

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ChromeModa Solutions

Germany . 3,032 parts In-Stock

1+ parts

$12.012

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$9.850

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3,032

$12.012

$9.850

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IDEA Electronic Components Group

UK . 64 parts In-Stock

1+ parts

$12.012

100+ parts

$11.411

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$10.811

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64

$12.012

$11.411

$10.811

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AZTECH Wire

Italy . 659 parts In-Stock

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$21.840

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659

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Component Stockers USA

USA . 26,417 parts In-Stock

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,180 parts In-Stock

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Lixinc

USA . 4,348 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,120 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Kepictronics

USA . 2,000 parts In-Stock

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Overview

Elevate your telecom interface experience with the CC2530F32RHAR by Texas Instruments. Known for their high-quality products, Texas Instruments delivers exceptional performance and reliability in the field of Other Function Telecom Interface ICs. This innovative product offers customers unparalleled value and benefits, with a wide range of applications in automotive and telecommunications. Experience the advantages of this cutting-edge technology and elevate your projects to new heights with the CC2530F32RHAR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable package for the IC, making it suitable for various applications.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, making it ideal for use in demanding environments.

Nominal Supply Voltage: 3 V

Operates at a standard supply voltage, making it compatible with common power sources.

Technical Specifications

Other Function Telecom Interface ICs CC2530F32RHAR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

CC2530F32RHAR Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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