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CC2500RTKG3

Texas Instruments

CC2500RTKG3 by Texas Instruments

CC2500RTKG3 by Texas Instruments is a telecom IC with 20 terminals, operating at temperatures from -40 to 85°C. It has a supply voltage of 3V and uses CMOS technology. With a package style of CHIP CARRIER, it is suitable for industrial applications requiring a compact design and surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,464 parts In-Stock

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6,464

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Digiode

USA . 2,545 parts In-Stock

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2,545

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 746 parts In-Stock

1+ parts

$0.277

100+ parts

-

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$0.266

746

$0.277

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$0.266

Northwest PG Solutions

USA . 691 parts In-Stock

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$0.304

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-

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$0.268

691

$0.304

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$0.268

AZTECH Wire

Italy . 604 parts In-Stock

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$8.668

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604

$8.668

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Parana Technologies

USA . 672 parts In-Stock

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$13.029

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$13.525

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672

$13.029

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$13.525

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ChromeModa Solutions

Germany . 2,675 parts In-Stock

1+ parts

$14.639

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$12.004

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2,675

$14.639

$12.004

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IDEA Electronic Components Group

UK . 1,471 parts In-Stock

1+ parts

$14.639

100+ parts

$13.907

1k+ parts

$13.175

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1,471

$14.639

$13.907

$13.175

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One Stop Electronics

USA . 752 parts In-Stock

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$704.000

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752

$704.000

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Corphita

USA . 186 parts In-Stock

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186

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DigiPath Technology Company

USA . 1 parts In-Stock

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$13.199

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1

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$13.199

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Overview

Unlock endless possibilities with the CC2500RTKG3 by Texas Instruments. This high-quality telecom interface IC offers unparalleled performance and reliability, thanks to its cutting-edge technology and industrial-grade design. From wireless communication systems to remote controls, this versatile chip carrier is ready to power your next project. Say goodbye to limitations and hello to innovation with the CC2500RTKG3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable, this product simplifies the assembly process and allows for efficient PCB layout, saving time and costs.

Package Shape: SQUARE

The square package shape enables easy placement and routing on the PCB, optimizing space and enhancing overall design flexibility.

Power Supplies (V): 1.8/3.6

The dual power supply options of 1.8V and 3.6V cater to different voltage requirements, making the product versatile and adaptable to various systems.

No. of Terminals: 20

With 20 terminals, this product offers ample connectivity options, allowing for versatile configuration and integration in telecom interface applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance in demanding industrial environments, enhancing the product's durability and longevity.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the product to function effectively in extreme cold conditions, ensuring reliable operation in various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold as the terminal finish provides excellent conductivity and corrosion resistance, ensuring stable performance over time.

Maximum Seated Height: 0.9 mm

The low maximum seated height of 0.9mm enables compact and slim designs, ideal for space-constrained applications in telecom interfaces.

Width: 4 mm

The narrow width of 4mm allows for efficient layout and compact integration on the PCB, optimizing space utilization and enhancing overall system design.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures secure solder joints during the assembly process, enhancing the product's reliability and performance.

Temperature Grade: INDUSTRIAL

The industrial temperature grade designation confirms the product's suitability for use in rugged industrial environments, showcasing its robustness and durability.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, enhancing the product's efficiency and reliability in telecom interface applications.

Technical Specifications

Other Function Telecom Interface ICs CC2500RTKG3 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.6

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

CC2500RTKG3 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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