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CC2430ZF128RTCR

Texas Instruments

CC2430ZF128RTCR by Texas Instruments

CC2430ZF128RTCR by Texas Instruments is a Telecom IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, has a data rate of 0.25 Mbps, and requires a nominal voltage of 3V. Ideal for industrial applications requiring low-power telecom circuits.

Median Price

$15.601

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 278 parts In-Stock

1+ parts

$20.560

100+ parts

$14.040

1k+ parts

$11.580

10k+ parts

$11.560

278

$20.560

$14.040

$11.580

$11.560

DigiKey

USA . 2,500 parts In-Stock

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$10.642

2,500

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$10.642

Distributors (In-Stock)

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$9.034

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-

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150

$9.034

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Digiode

USA . 4,420 parts In-Stock

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$15.190

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4,420

$15.190

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Chip Stock

USA . 2,940 parts In-Stock

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Vyrian

USA . 1,959 parts In-Stock

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1,959

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LIBRA Elektronik GmbH

Germany . 535 parts In-Stock

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535

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Distributors (Availability)

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Parana Technologies

USA . 1,974 parts In-Stock

1+ parts

$9.644

100+ parts

-

1k+ parts

$10.234

10k+ parts

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1,974

$9.644

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$10.234

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DigiPath Technology Company

USA . 1,876 parts In-Stock

1+ parts

$10.619

100+ parts

$9.770

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1,876

$10.619

$9.770

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ChromeModa Solutions

Germany . 6,357 parts In-Stock

1+ parts

$10.836

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$8.886

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$10.836

$8.886

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IDEA Electronic Components Group

UK . 2,329 parts In-Stock

1+ parts

$10.836

100+ parts

$10.294

1k+ parts

$9.752

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2,329

$10.836

$10.294

$9.752

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Corphita

USA . 4,573 parts In-Stock

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$14.391

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$14.391

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Lixinc

USA . 19,993 parts In-Stock

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Authorized Procurement Solutions

USA . 8,500 parts In-Stock

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Perfect Parts

USA . 5,620 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

$8.853

1k+ parts

$8.582

10k+ parts

$8.401

2,000

-

$8.853

$8.582

$8.401

Kepictronics

USA . 25 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the CC2430ZF128RTCR by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products that exceed expectations. This telecom interface IC offers unparalleled reliability and performance, making it ideal for a wide range of applications. With its innovative design and advanced features, customers can trust that they are getting the best value for their investment. Experience the benefits of seamless connectivity and superior functionality with the CC2430ZF128RTCR. Elevate your projects to the next level with this exceptional product.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving time and cost in production.

Package Shape: SQUARE

Square package shape provides better space utilization and allows for a more compact design of the product.

No. of Terminals: 48

Having 48 terminals allows for more connectivity options and versatility in the circuit design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and ensure reliability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the product can perform well even in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability of the connections.

Maximum Seated Height: 0.9 mm

The low maximum seated height allows for a more compact design and minimizes space requirements on the PCB.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3V makes this product energy-efficient and suitable for low-power applications.

Data Rate: 0.25 Mbps

The data rate of 0.25 Mbps ensures efficient data transmission, making the product ideal for telecom interface applications.

Technical Specifications

Other Function Telecom Interface ICs CC2430ZF128RTCR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

.25 Mbps

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

CC2430ZF128RTCR Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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