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CC2431RTCR

Texas Instruments

CC2431RTCR by Texas Instruments

The Texas Instruments CC2431RTCR is a telecom circuit IC in a square chip carrier package with 48 terminals. It features nickel palladium gold terminal finish, measures 7mm in width and length, and can withstand peak reflow temperature of 260°C for up to 30s. Ideal for applications requiring reliable telecom interface functions.

Median Price

$9.613

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,580 parts In-Stock

1+ parts

-

100+ parts

$7.690

1k+ parts

$6.880

10k+ parts

$6.470

1,580

-

$7.690

$6.880

$6.470

DigiKey

USA . 1,580 parts In-Stock

1+ parts

-

100+ parts

$10.110

1k+ parts

-

10k+ parts

-

1,580

-

$10.110

-

-

Verical

USA . 1,580 parts In-Stock

1+ parts

-

100+ parts

$9.613

1k+ parts

$8.600

10k+ parts

$8.088

1,580

-

$9.613

$8.600

$8.088

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,526 parts In-Stock

1+ parts

$8.113

100+ parts

-

1k+ parts

-

10k+ parts

-

4,526

$8.113

-

-

-

Vyrian

USA . 1,428 parts In-Stock

1+ parts

$8.540

100+ parts

-

1k+ parts

-

10k+ parts

-

1,428

$8.540

-

-

-

DigiKey Marketplace

USA . 1,580 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,580

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 5 parts In-Stock

1+ parts

$0.746

100+ parts

-

1k+ parts

-

10k+ parts

-

5

$0.746

-

-

-

Northwest PG Solutions

USA . 1,690 parts In-Stock

1+ parts

$0.821

100+ parts

-

1k+ parts

-

10k+ parts

-

1,690

$0.821

-

-

-

Parana Technologies

USA . 978 parts In-Stock

1+ parts

$6.404

100+ parts

-

1k+ parts

$7.152

10k+ parts

-

978

$6.404

-

$7.152

-

DigiPath Technology Company

USA . 444 parts In-Stock

1+ parts

$7.051

100+ parts

-

1k+ parts

-

10k+ parts

-

444

$7.051

-

-

-

ChromeModa Solutions

Germany . 1,290 parts In-Stock

1+ parts

$7.195

100+ parts

$5.900

1k+ parts

-

10k+ parts

-

1,290

$7.195

$5.900

-

-

IDEA Electronic Components Group

UK . 1,150 parts In-Stock

1+ parts

$7.195

100+ parts

-

1k+ parts

$6.476

10k+ parts

-

1,150

$7.195

-

$6.476

-

Corphita

USA . 4,047 parts In-Stock

1+ parts

$7.686

100+ parts

-

1k+ parts

-

10k+ parts

-

4,047

$7.686

-

-

-

Kepictronics

USA . 50,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50,000

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 420 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

420

-

-

-

-

Robosynatics

Brazil . 350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

350

-

-

-

-

Lucentia Tech

USA . 350 parts In-Stock

1+ parts

-

100+ parts

$17.257

1k+ parts

$15.980

10k+ parts

$15.980

350

-

$17.257

$15.980

$15.980

Overview

Elevate your telecom interface capabilities with the CC2431RTCR by Texas Instruments. Known for their top-notch quality and innovation, Texas Instruments delivers a cutting-edge solution for your telecom needs. This versatile product, with its surface mount design and quad terminal position, is perfect for a wide range of applications in the telecom industry. With its nickel palladium gold terminal finish and no-lead terminal form, this product ensures reliability and efficiency. Experience the value and benefits that Texas Instruments brings to the table with the CC2431RTCR.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on PCBs, saving space and simplifying the manufacturing process.

Package Shape: SQUARE

Square package shape offers good stability and ease of handling during assembly and testing.

No. of Terminals: 48

Having 48 terminals provides sufficient connectivity options for various telecom interfaces and circuits.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers excellent thermal performance and protection for the integrated circuits within.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish ensures high conductivity and reliability for long-term usage.

Terminal Position: QUAD

Quad terminal position allows for secure and stable connection on the PCB, minimizing the risk of disconnection.

Width: 7 mm

A compact width of 7 mm saves valuable PCB real estate and allows for efficient use of space in telecom applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, the product can undergo thermal processes efficiently during manufacturing.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260°C ensures proper soldering of the IC to the PCB, resulting in reliable connections.

Length: 7 mm

A length of 7 mm complements the compact width, making the product suitable for space-constrained telecom applications.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and complies with RoHS regulations, reducing the environmental impact of the product.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product requires intermediate moisture protection during storage and handling, ensuring its integrity and reliability.

Technical Specifications

Other Function Telecom Interface ICs CC2431RTCR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

CC2431RTCR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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