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CC2430F64RTCR

Texas Instruments

CC2430F64RTCR by Texas Instruments

The Texas Instruments CC2430F64RTCR is a telecom IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a data rate of 0.25 Mbps. Ideal for industrial applications requiring a 3V supply voltage and CMOS technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 8,987 parts In-Stock

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Digiode

USA . 331 parts In-Stock

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Amalfi Trading

USA . 5 parts In-Stock

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Native Components

USA . 303 parts In-Stock

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$0.709

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303

$0.709

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Northwest PG Solutions

USA . 1,919 parts In-Stock

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$0.780

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$0.780

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AZTECH Wire

Italy . 695 parts In-Stock

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$9.724

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695

$9.724

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Parana Technologies

USA . 1,710 parts In-Stock

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$15.791

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$1,466.459

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$14.212

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DigiPath Technology Company

USA . 1,912 parts In-Stock

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$17.388

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IDEA Electronic Components Group

UK . 2,285 parts In-Stock

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$17.743

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$16.856

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$15.969

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ChromeModa Solutions

Germany . 1,552 parts In-Stock

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$17.743

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$14.549

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Component Stockers USA

USA . 706 parts In-Stock

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$122.030

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One Stop Electronics

USA . 1,124 parts In-Stock

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$707.000

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Lixinc

USA . 16,980 parts In-Stock

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Kepictronics

USA . 9,995 parts In-Stock

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Authorized Procurement Solutions

USA . 9,000 parts In-Stock

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Corphita

USA . 4,640 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,999 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,999 parts In-Stock

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Robosynatics

Brazil . 150 parts In-Stock

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$12.049

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$11.157

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$11.157

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Lucentia Tech

USA . 150 parts In-Stock

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$12.049

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$11.157

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$11.157

150

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$12.049

$11.157

$11.157

Overview

Discover the CC2430F64RTCR by Texas Instruments, a top-of-the-line Telecom Interface IC with unparalleled quality and reliability. Manufactured by the industry leader, this product excels in various applications and is designed for optimal performance. With a sleek surface mount design and cutting-edge technology, customers can expect seamless integration and superior functionality. Experience the value and benefits of this innovative product, offering unmatched advantages that set it apart from the competition. Unlock new possibilities with the CC2430F64RTCR and elevate your projects to new heights.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and secure attachment to a PCB, reducing assembly time and cost.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB, enabling compact designs.

No. of Terminals: 48

Sufficient number of terminals to support complex telecom interfaces and functions.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operates reliably in low temperatures as well, increasing the product's versatility.

Data Rate: 0.25 Mbps

Supports a data rate of 0.25 Mbps, suitable for various telecom applications requiring moderate speed.

Technical Specifications

Other Function Telecom Interface ICs CC2430F64RTCR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

.25 Mbps

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

CC2430F64RTCR Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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