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CC2430F64RTC

Texas Instruments

CC2430F64RTC by Texas Instruments

CC2430F64RTC by Texas Instruments is a telecom IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a data rate of 0.25 Mbps and nominal voltage of 3V. Ideal for industrial applications requiring low power consumption and reliable communication at high temperatures.

Median Price

$8.750

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2 parts In-Stock

1+ parts

-

100+ parts

$8.750

1k+ parts

$7.830

10k+ parts

$7.370

2

-

$8.750

$7.830

$7.370

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,189 parts In-Stock

1+ parts

$8.037

100+ parts

-

1k+ parts

-

10k+ parts

-

4,189

$8.037

-

-

-

Vyrian

USA . 6,822 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

6,822

-

-

-

-

TME

Poland . 780 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$13.218

10k+ parts

-

780

-

-

$13.218

-

Goldney Electronics S.L.

Spain . 379 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

379

-

-

-

-

Bristol Electronics

USA . 193 parts In-Stock

1+ parts

-

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193

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 955 parts In-Stock

1+ parts

$1.512

100+ parts

-

1k+ parts

-

10k+ parts

-

955

$1.512

-

-

-

Northwest PG Solutions

USA . 1,167 parts In-Stock

1+ parts

$1.663

100+ parts

-

1k+ parts

-

10k+ parts

-

1,167

$1.663

-

-

-

Ampacity Inc.

Singapore . 2 parts In-Stock

1+ parts

$7.190

100+ parts

-

1k+ parts

-

10k+ parts

-

2

$7.190

-

-

-

Corphita

USA . 3,585 parts In-Stock

1+ parts

$7.614

100+ parts

-

1k+ parts

-

10k+ parts

-

3,585

$7.614

-

-

-

Parana Technologies

USA . 1,690 parts In-Stock

1+ parts

$10.240

100+ parts

-

1k+ parts

$10.774

10k+ parts

-

1,690

$10.240

-

$10.774

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ChromeModa Solutions

Germany . 3,094 parts In-Stock

1+ parts

$11.506

100+ parts

$9.435

1k+ parts

-

10k+ parts

-

3,094

$11.506

$9.435

-

-

IDEA Electronic Components Group

UK . 209 parts In-Stock

1+ parts

$11.506

100+ parts

$10.931

1k+ parts

$10.355

10k+ parts

-

209

$11.506

$10.931

$10.355

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Perfect Parts

USA . 4,659 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,659

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-

-

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DigiPath Technology Company

USA . 1,705 parts In-Stock

1+ parts

-

100+ parts

$10.374

1k+ parts

-

10k+ parts

-

1,705

-

$10.374

-

-

Overview

Experience superior quality and reliability with the Texas Instruments CC2430F64RTC, a cutting-edge telecom interface IC that is sure to exceed your expectations. With Texas Instruments' renowned reputation for excellence in manufacturing, this product offers unmatched performance and durability. Ideal for a wide range of applications, this chip carrier boasts a very thin profile and quad terminal position, making it versatile and efficient. Upgrade your telecom systems with ease and confidence, thanks to the value, benefits, and advantages that the CC2430F64RTC brings to the table. Trust Texas Instruments to deliver innovation that truly makes a difference.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy and efficient installation on circuit boards, making this product suitable for automated assembly processes.

Package Shape: SQUARE

The square package shape helps optimize space on the circuit board, making it ideal for compact designs.

No. of Terminals: 48

With a high number of terminals, this product enables complex telecom interface functions to be implemented effectively.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in various industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function efficiently even in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances the durability and conductivity of the terminals, ensuring long-term performance.

Terminal Position: QUAD

The quad terminal position provides additional connectivity options, allowing for versatile application possibilities.

Nominal Supply Voltage: 3 V

The 3V supply voltage requirement is commonly available and compatible with many existing power sources.

Data Rate: 0.25 Mbps

The data rate of 0.25 Mbps supports efficient data transmission for telecom interface functions.

Technical Specifications

Other Function Telecom Interface ICs CC2430F64RTC attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

.25 Mbps

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

CC2430F64RTC Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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