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CC2430ZF128RTC

Texas Instruments

CC2430ZF128RTC by Texas Instruments

CC2430ZF128RTC by Texas Instruments is a Telecom IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, has a data rate of 0.25 Mbps, and runs on a 3V supply voltage. Ideal for telecom circuits, this CMOS technology IC is designed for industrial applications requiring low-profile surface mount components.

Median Price

$13.585

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 44 parts In-Stock

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$13.585

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USA . 3,095 parts In-Stock

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Vyrian

USA . 1,016 parts In-Stock

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Digiode

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Parana Technologies

USA . 127 parts In-Stock

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$8.219

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$8.831

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DigiPath Technology Company

USA . 1,359 parts In-Stock

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$9.050

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ChromeModa Solutions

Germany . 4,893 parts In-Stock

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$9.235

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$7.573

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IDEA Electronic Components Group

UK . 489 parts In-Stock

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$9.235

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$8.773

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$8.312

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Netroflash

USA . 2,000 parts In-Stock

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Component Stockers USA

USA . 182 parts In-Stock

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$14.410

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AZTECH Wire

Italy . 527 parts In-Stock

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$19.096

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One Stop Electronics

USA . 1,500 parts In-Stock

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Corphita

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Glotronic Ltd.

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Computer Components Inc. - USA

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Perfect Parts

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Overview

Experience seamless communication with the Texas Instruments CC2430ZF128RTC. This innovative telecom interface IC, designed with precision by Texas Instruments, offers unparalleled quality and reliability. Perfect for a wide range of applications, this chip carrier boasts a very thin profile and a high operating temperature range, making it ideal for industrial use. With its advanced CMOS technology and no-lead terminal form, customers can trust in the performance and durability of this product. Upgrade your telecom systems today with the CC2430ZF128RTC and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of these package styles ensures effective heat dissipation, compact design, and low profile, making it suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand demanding industrial environments without compromising performance.

Nominal Supply Voltage: 3 V

Operates efficiently at a standard supply voltage of 3V, making it compatible with a wide range of systems.

Data Rate: 0.25 Mbps

Offers a decent data rate of 0.25 Mbps, suitable for telecom applications that require moderate-speed data transmission.

Technical Specifications

Other Function Telecom Interface ICs CC2430ZF128RTC attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

.25 Mbps

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

CC2430ZF128RTC Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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