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CC2420/TR

Texas Instruments

CC2420/TR by Texas Instruments

CC2420/TR by Texas Instruments is a CMOS telecom interface IC with 48 terminals in a square chip carrier package. It operates b/w -40°C to 85°C, suitable for industrial applications. With power supplies of 1.8V and 1.8/3.3V, it's ideal for surface mount designs requiring high performance in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,381 parts In-Stock

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Digiode

USA . 564 parts In-Stock

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564

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Distributors (Availability)

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Parana Technologies

USA . 1,795 parts In-Stock

1+ parts

$7.406

100+ parts

-

1k+ parts

$7.896

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1,795

$7.406

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$7.896

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DigiPath Technology Company

USA . 1,326 parts In-Stock

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$8.155

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1,326

$8.155

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IDEA Electronic Components Group

UK . 1,705 parts In-Stock

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$8.321

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$7.905

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$7.489

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1,705

$8.321

$7.905

$7.489

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ChromeModa Solutions

Germany . 709 parts In-Stock

1+ parts

$8.321

100+ parts

$6.823

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709

$8.321

$6.823

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AZTECH Wire

Italy . 849 parts In-Stock

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$15.233

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849

$15.233

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One Stop Electronics

USA . 561 parts In-Stock

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$659.000

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561

$659.000

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Corphita

USA . 2,458 parts In-Stock

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Northwest PG Solutions

USA . 1,081 parts In-Stock

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$3.587

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Native Components

USA . 997 parts In-Stock

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$3.550

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997

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$3.550

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Overview

Texas Instruments' CC2420/TR is a game-changer in the world of telecom interface ICs. With a package body material made of durable plastic/epoxy, this chip carrier offers top-notch reliability and performance. Ideal for a wide range of applications, this product boasts power supplies ranging from 1.8V to 3.3V, making it versatile and adaptable to various systems. Texas Instruments' commitment to quality shines through in the CC2420/TR, providing customers with unmatched value, benefits, and advantages. Experience seamless connectivity and enhanced functionality with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the IC, making it suitable for long-term use.

Surface Mount: YES

The surface mount capability allows for easy and secure installation on printed circuit boards, saving space and simplifying assembly.

Package Shape: SQUARE

The square package shape ensures efficient use of board space and facilitates uniform mounting.

Power Supplies (V): 1.8, 1.8/3.3

The multiple power supply options allow for flexibility in design, catering to different voltage requirements.

No. of Terminals: 48

Having a high number of terminals provides ample connectivity options for various interfaces and peripherals.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers improved heat dissipation and signal integrity, enhancing overall performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable operation even in harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for dependable performance in extreme cold conditions.

Terminal Position: QUAD

The quad terminal position enables efficient routing of connections, reducing signal interference and optimizing signal transfer.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the IC can withstand demanding industrial settings with consistent performance.

Technology: CMOS

The CMOS technology offers low power consumption and high speed, making the IC energy-efficient and responsive.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the soldering process and minimizes the risk of damage during assembly.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables high-density mounting and precise connections, ideal for compact device designs.

Technical Specifications

Other Function Telecom Interface ICs CC2420/TR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N48

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

1.8,1.8/3.3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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