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CC2430F64RTCG3

Texas Instruments

CC2430F64RTCG3 by Texas Instruments

CC2430F64RTCG3 by Texas Instruments is a 48-terminal IC with CMOS technology, suitable for telecom circuits. It operates b/w -40 to 85°C, with a nominal voltage of 3V. The chip carrier package style has a very thin profile and nickel palladium gold finish, making it ideal for industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,902 parts In-Stock

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Digiode

USA . 4,078 parts In-Stock

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4,078

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Distributors (Availability)

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Northwest PG Solutions

USA . 724 parts In-Stock

1+ parts

$2.427

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724

$2.427

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Parana Technologies

USA . 694 parts In-Stock

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$12.899

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$13.384

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694

$12.899

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$13.384

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DigiPath Technology Company

USA . 596 parts In-Stock

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$14.203

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596

$14.203

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ChromeModa Solutions

Germany . 4,948 parts In-Stock

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$14.493

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$11.884

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4,948

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$11.884

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IDEA Electronic Components Group

UK . 2,279 parts In-Stock

1+ parts

$14.493

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$13.768

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$13.044

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2,279

$14.493

$13.768

$13.044

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AZTECH Wire

Italy . 722 parts In-Stock

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$19.550

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722

$19.550

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One Stop Electronics

USA . 1,101 parts In-Stock

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$881.000

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Corphita

USA . 3,324 parts In-Stock

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Native Components

USA . 263 parts In-Stock

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$2.140

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$2.140

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Overview

Elevate your telecom projects with the CC2430F64RTCG3 by Texas Instruments, a premium quality telecom interface IC that delivers unrivaled performance and reliability. With Texas Instruments renowned expertise in semiconductor manufacturing, this product boasts cutting-edge technology and precise engineering for seamless integration. Whether you're designing wireless communication systems, smart meters, or industrial automation solutions, the CC2430F64RTCG3 offers exceptional value, efficiency, and versatility. Upgrade your applications with this innovative solution and experience the difference in performance and functionality.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and labor costs.

Package Shape: SQUARE

Square package shape is compact and space-saving, ideal for applications with limited board space.

No. of Terminals: 48

Provides ample connectivity options for various interfaces and peripherals.

Maximum Operating Temperature: 85 °C

Can operate in higher temperature environments, ensuring reliability and performance under demanding conditions.

Nominal Supply Voltage: 3 V

Low power consumption with a nominal supply voltage of 3V, suitable for energy-efficient applications.

Technical Specifications

Other Function Telecom Interface ICs CC2430F64RTCG3 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

CC2430F64RTCG3 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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