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AM3356BZCZD30

Texas Instruments

AM3356BZCZD30 by Texas Instruments

AM3356BZCZD30 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 16-bit external data bus width, and max clock frequency of 26 MHz. Ideal for industrial applications requiring low power mode, it features a terminal pitch of 0.8 mm and operates at temperatures ranging from -40 to 90 °C.

Median Price

$13.016

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 827 parts In-Stock

1+ parts

$13.016

100+ parts

$11.369

1k+ parts

$7.841

10k+ parts

-

827

$13.016

$11.369

$7.841

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,469 parts In-Stock

1+ parts

$12.365

100+ parts

-

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-

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2,469

$12.365

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Vyrian

USA . 2,653 parts In-Stock

1+ parts

-

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-

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-

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2,653

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 560 parts In-Stock

1+ parts

$4.957

100+ parts

-

1k+ parts

-

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560

$4.957

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-

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AZTECH Wire

Italy . 802 parts In-Stock

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$10.050

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-

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802

$10.050

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Corphita

USA . 3,787 parts In-Stock

1+ parts

$11.714

100+ parts

-

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3,787

$11.714

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Parana Technologies

USA . 307 parts In-Stock

1+ parts

$15.393

100+ parts

$1,429.432

1k+ parts

$13.853

10k+ parts

-

307

$15.393

$1,429.432

$13.853

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DigiPath Technology Company

USA . 759 parts In-Stock

1+ parts

$16.949

100+ parts

$15.593

1k+ parts

-

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759

$16.949

$15.593

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IDEA Electronic Components Group

UK . 2,055 parts In-Stock

1+ parts

$17.295

100+ parts

$16.430

1k+ parts

$15.566

10k+ parts

-

2,055

$17.295

$16.430

$15.566

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ChromeModa Solutions

Germany . 306 parts In-Stock

1+ parts

$17.295

100+ parts

$14.182

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-

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306

$17.295

$14.182

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Microchip USA

USA . 1,901 parts In-Stock

1+ parts

$37.580

100+ parts

$37.040

1k+ parts

$36.770

10k+ parts

$36.500

1,901

$37.580

$37.040

$36.770

$36.500

Perfect Parts

USA . 1,976 parts In-Stock

1+ parts

-

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1,976

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Northwest PG Solutions

USA . 1,335 parts In-Stock

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100+ parts

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$4.858

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1,335

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$4.858

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Component Stockers USA

USA . 843 parts In-Stock

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843

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Overview

Discover the power and precision of the AM3356BZCZD30 by Texas Instruments. As a leader in microprocessor technology, Texas Instruments delivers cutting-edge solutions for a wide range of applications. Whether you're designing embedded systems, industrial automation, or IoT devices, this microprocessor offers unparalleled performance and reliability. With integrated cache, low power mode, and a maximum clock frequency of 26 MHz, the AM3356BZCZD30 is the ideal choice for your next project. Experience the quality and innovation that only Texas Instruments can provide. Elevate your designs with the AM3356BZCZD30 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microprocessor, ensuring it can withstand various environmental conditions.

Integrated Cache: YES

Having an integrated cache improves processing speed and efficiency, making the product ideal for high-performance applications.

Maximum Supply Voltage: 1.144 V

The maximum supply voltage is within a safe range, preventing the risk of damage from overvoltage.

On Chip Data RAM Width: 8

A wider data RAM width allows for faster data access and manipulation, enhancing overall performance.

Address Bus Width: 28

A wider address bus width increases memory addressability, enabling the microprocessor to handle larger data sets efficiently.

Package Shape: SQUARE

The square package shape facilitates easier mounting and placement on circuit boards, optimizing space utilization.

Bit Size: 32

A 32-bit architecture allows for handling larger chunks of data at a time, improving processing speed and efficiency.

Power Supplies (V): 0.95/1.1

Having multiple power supply options provides flexibility in voltage regulation, ensuring compatibility with various system requirements.

No. of Terminals: 324

Having a high number of terminals allows for a greater connection capability, enabling the microprocessor to communicate with multiple components effectively.

Technical Specifications

Microprocessors AM3356BZCZD30 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT MIN 0.912 V

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.4 mm

Speed:

300 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.144 V

Minimum Supply Voltage:

1.056 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AM3356BZCZD30 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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