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AM3352ZCZ60

Texas Instruments

AM3352ZCZ60 by Texas Instruments

AM3352ZCZ60 by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit external data bus width. It operates at a max clock frequency of 48 MHz, making it suitable for low power applications in various industries such as IoT, industrial automation, and consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,297 parts In-Stock

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Digiode

USA . 1,183 parts In-Stock

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Electronics Depot

USA . 40 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 8 parts In-Stock

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Classic Components Corporation

USA . 5 parts In-Stock

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One Stop Electronics

USA . 541 parts In-Stock

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$5.000

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541

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AZTECH Wire

Italy . 638 parts In-Stock

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$14.775

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Parana Technologies

USA . 34 parts In-Stock

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$65.530

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DigiPath Technology Company

USA . 1,372 parts In-Stock

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$72.156

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ChromeModa Solutions

Germany . 1,532 parts In-Stock

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$73.629

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$60.376

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IDEA Electronic Components Group

UK . 308 parts In-Stock

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$73.629

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$69.948

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$66.266

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Corphita

USA . 4,655 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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Native Components

USA . 778 parts In-Stock

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Perfect Parts

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Northwest PG Solutions

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Microchip USA

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments AM3352ZCZ60 microprocessor. Crafted with precision and expertise, this innovative product is designed to deliver top-notch performance in a variety of applications. From industrial automation to consumer electronics, this microprocessor offers unmatched value, efficiency, and reliability. Experience seamless operation and enhanced functionality with the AM3352ZCZ60 by Texas Instruments. Elevate your projects to the next level with this superior quality microprocessor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and increases resistance to external factors, making the product long-lasting.

Integrated Cache: YES

Having integrated cache improves the processing speed of the microprocessor, enhancing overall performance.

Maximum Supply Voltage: 1.144 V

Operating within the specified maximum supply voltage ensures the safety and stability of the microprocessor.

Address Bus Width: 16

Having a wider address bus width allows for better memory addressing capabilities, resulting in improved data handling.

Bit Size: 32

A 32-bit architecture enables the microprocessor to handle larger chunks of data at once, increasing efficiency.

Power Supplies (V): 0.95/1.1,0.95/1.26

Multiple power supply options provide flexibility in voltage selection based on the power requirements of the system.

No. of Terminals: 324

Having a higher number of terminals allows for more connections, facilitating better communication and data transfer.

Peripheral IC Type: MICROPROCESSOR, RISC

Designed as a microprocessor with Reduced Instruction Set Computing (RISC) architecture, making it efficient in executing instructions quickly.

Format: FIXED POINT

Using fixed-point format simplifies mathematical calculations and enhances speed in processing numerical data.

Low Power Mode: YES

The availability of a low power mode allows for energy-efficient operation, reducing power consumption and extending battery life in portable devices.

Technical Specifications

Microprocessors AM3352ZCZ60 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

324

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1,0.95/1.26

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Speed:

600 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.144 V

Minimum Supply Voltage:

1.056 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AM3352ZCZ60 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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