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AM3352BZCE30R

Texas Instruments

AM3352BZCE30R by Texas Instruments

AM3352BZCE30R by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It features a max clock frequency of 26 MHz and operates at low power mode, making it suitable for applications requiring high-speed processing in compact devices. With a terminal pitch of 0.65 mm and boundary scan capability, this processor is ideal for use in embedded systems that demand efficient data handling and minimal power consumption.

Median Price

$10.970

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,989 parts In-Stock

1+ parts

$8.619

100+ parts

$7.528

1k+ parts

$5.192

10k+ parts

-

5,989

$8.619

$7.528

$5.192

-

Mouser Electronics

USA . 6 parts In-Stock

1+ parts

$13.320

100+ parts

$8.550

1k+ parts

$7.080

10k+ parts

-

6

$13.320

$8.550

$7.080

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$7.269

100+ parts

-

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-

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750

$7.269

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-

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Digiode

USA . 2,223 parts In-Stock

1+ parts

$8.188

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-

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2,223

$8.188

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-

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VNN

France . 10,782 parts In-Stock

1+ parts

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10,782

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Vyrian

USA . 8,802 parts In-Stock

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-

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8,802

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LIBRA Elektronik GmbH

Germany . 3,756 parts In-Stock

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3,756

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North Shore Components

USA . 2,987 parts In-Stock

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-

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2,987

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 500 parts In-Stock

1+ parts

$7.269

100+ parts

-

1k+ parts

-

10k+ parts

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500

$7.269

-

-

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Ampacity Inc.

Singapore . 2,719 parts In-Stock

1+ parts

$7.330

100+ parts

-

1k+ parts

-

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2,719

$7.330

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Corphita

USA . 2,213 parts In-Stock

1+ parts

$7.757

100+ parts

-

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2,213

$7.757

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Parana Technologies

USA . 992 parts In-Stock

1+ parts

$18.718

100+ parts

-

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$18.809

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992

$18.718

-

$18.809

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DigiPath Technology Company

USA . 253 parts In-Stock

1+ parts

$20.611

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253

$20.611

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IDEA Electronic Components Group

UK . 1,221 parts In-Stock

1+ parts

$21.032

100+ parts

$19.980

1k+ parts

$18.929

10k+ parts

-

1,221

$21.032

$19.980

$18.929

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ChromeModa Solutions

Germany . 808 parts In-Stock

1+ parts

$21.032

100+ parts

$17.246

1k+ parts

-

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808

$21.032

$17.246

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Corohmni

South Africa . 503 parts In-Stock

1+ parts

$22.321

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503

$22.321

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$45.028

100+ parts

$40.975

1k+ parts

$36.923

10k+ parts

-

3,000

$45.028

$40.975

$36.923

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Lixinc

USA . 15,089 parts In-Stock

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15,089

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A-Z Elektronik GmbH

Germany . 7,215 parts In-Stock

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7,215

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Alle Elektronik GmbH

Germany . 4,810 parts In-Stock

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4,810

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

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4,000

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Kepictronics

USA . 1,756 parts In-Stock

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1,756

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Formix International (Excess)

India . 1,123 parts In-Stock

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1,123

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Overview

Unlock the power of cutting-edge technology with the AM3352BZCE30R by Texas Instruments. As a leader in microprocessor innovation, Texas Instruments delivers unmatched quality and reliability, setting the standard for performance in the industry. This versatile processor is perfect for a wide range of applications, offering seamless integration and exceptional efficiency. Experience the value and benefits of advanced technology with the AM3352BZCE30R, providing customers with a competitive edge and unparalleled performance. Elevate your projects to the next level with this top-of-the-line microprocessor from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microprocessor, ensuring a longer lifespan.

Integrated Cache: YES

Having integrated cache improves the performance of the microprocessor by reducing memory access time and increasing overall speed.

Maximum Supply Voltage: 1.144 V

Operates efficiently within a safe voltage range, preventing overheating or damage to the microprocessor.

Address Bus Width: 28

A wider address bus width allows for more memory addressable locations, enabling the microprocessor to handle larger amounts of data.

RAM Words: 131072

With a large RAM capacity, the microprocessor can efficiently process and store a significant amount of data for various tasks.

Technical Specifications

Microprocessors AM3352BZCE30R attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT MIN 0.912 V

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B298

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

298

On Chip Data RAM Width:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA298,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.3 mm

Speed:

300 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.144 V

Minimum Supply Voltage:

1.056 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

AM3352BZCE30R Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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