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AM2632COMFHAZCZR

Texas Instruments

AM2632COMFHAZCZR by Texas Instruments

The Texas Instruments AM2632COMFHAZCZR microcontroller features a 22-bit address bus, 8-bit on-chip data RAM width, and 1.26V max supply voltage. Ideal for applications requiring a low-profile package with integrated cache, such as automotive control systems or industrial automation.

Median Price

$20.108

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,286 parts In-Stock

1+ parts

$20.108

100+ parts

$17.564

1k+ parts

$12.113

10k+ parts

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1,286

$20.108

$17.564

$12.113

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Mouser Electronics

USA . 1,000 parts In-Stock

1+ parts

$31.130

100+ parts

$23.130

1k+ parts

$20.140

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-

1,000

$31.130

$23.130

$20.140

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DigiKey

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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$18.207

10k+ parts

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1,000

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-

$18.207

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Distributors (In-Stock)

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Vyrian

USA . 3,078 parts In-Stock

1+ parts

$15.900

100+ parts

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3,078

$15.900

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Digiode

USA . 1,229 parts In-Stock

1+ parts

$19.103

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1,229

$19.103

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 798 parts In-Stock

1+ parts

$13.520

100+ parts

$13.182

1k+ parts

$13.114

10k+ parts

-

798

$13.520

$13.182

$13.114

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Ampacity Inc.

Singapore . 788 parts In-Stock

1+ parts

$13.520

100+ parts

-

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788

$13.520

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Corohmni

South Africa . 415 parts In-Stock

1+ parts

$15.900

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415

$15.900

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Corphita

USA . 4,755 parts In-Stock

1+ parts

$18.097

100+ parts

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10k+ parts

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4,755

$18.097

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Microchip USA

USA . 2,374 parts In-Stock

1+ parts

$44.530

100+ parts

$43.900

1k+ parts

$43.580

10k+ parts

$43.260

2,374

$44.530

$43.900

$43.580

$43.260

Northwest PG Solutions

USA . 2,165 parts In-Stock

1+ parts

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$3.353

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2,165

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$3.353

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Native Components

USA . 972 parts In-Stock

1+ parts

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100+ parts

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$3.319

10k+ parts

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972

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$3.319

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Overview

Discover the power and versatility of the AM2632COMFHAZCZR microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products like this one, perfect for a wide range of applications. With integrated cache, multiple ADC and DAC channels, and a variety of peripherals, this microcontroller offers unmatched performance and efficiency. Whether you're designing automotive systems, industrial controls, or consumer electronics, the AM2632COMFHAZCZR provides the value and reliability you need to bring your projects to life. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components, offering good durability and protection for the microcontroller.

Integrated Cache: YES

Having an integrated cache helps improve processing speed and efficiency, making this microcontroller suitable for applications requiring fast data access.

Maximum Supply Voltage: 1.26 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with various systems.

On Chip Data RAM Width: 8

The wide data RAM width allows for efficient data processing and storage, enhancing the microcontroller's performance.

Address Bus Width: 22

A wider address bus allows for access to a larger memory space, making this microcontroller suitable for applications that require extensive memory usage.

Package Shape: SQUARE

The square package shape offers a compact design, making it easier to integrate this microcontroller into various electronic systems.

DAC Channels: YES

Having DAC channels enables the microcontroller to convert digital signals to analog signals, making it versatile for a wide range of applications.

No. of Terminals: 324

The high number of terminals provides ample connectivity options, allowing for versatile use in different electronic circuits and systems.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage helps in power efficiency and allows for operation in low-power applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures the microcontroller can withstand harsh operating conditions, making it suitable for industrial environments.

CPU Family: CORTEX-R5F

Being part of the Cortex-R5F family indicates high performance and reliability, making this microcontroller a great choice for demanding applications.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals to digital, expanding its capability for analog data processing.

DMA Channels: YES

DMA channels allow for efficient data transfer between peripherals and memory, enhancing overall system performance and speed.

Terminal Position: BOTTOM

Bottom terminal position makes it easier for soldering and assembly, ensuring a secure connection in the electronic circuit.

Maximum Seated Height: 1.4 mm

The low maximum seated height allows for a compact design, making this microcontroller suitable for applications with space constraints.

Digital To Analog Convertors: 1-Ch 12-Bit

Having a 12-bit DAC provides high-resolution analog output, making this microcontroller suitable for applications requiring precise analog signal generation.

Width: 15 mm

The compact width makes this microcontroller suitable for applications where space is limited, such as in portable devices or embedded systems.

Boundary Scan: YES

Boundary scan capability helps in testing and debugging the microcontroller, improving overall reliability and ease of development.

External Data Bus Width: 16

A wide external data bus width allows for high-speed data transfer, enhancing the performance of the microcontroller in data-intensive applications.

Peripherals: CAP(10), COMPARATOR(20), DMA, PWM(32), WDT

The variety of peripherals such as capacitors, comparators, PWM channels, and watchdog timers enhances the versatility and functionality of this microcontroller for different applications.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency allows for fast processing speed, making this microcontroller suitable for real-time applications and high-speed data processing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable soldering during assembly, making the microcontroller suitable for various manufacturing processes.

Length: 15 mm

The compact length of the microcontroller allows for space-efficient designs and compact electronic systems.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller offers high performance and efficiency in processing, making it a good choice for applications requiring fast and reliable operation.

RAM Bytes: 2097152

The large RAM capacity provides ample storage for data and programs, allowing for efficient operation and multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making this microcontroller energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

Ball terminal form facilitates easy soldering and assembly, providing a reliable connection in the electronic circuit.

Analog To Digital Convertors: 30-Ch 12-Bit

Having 30 ADC channels with 12-bit resolution enables accurate analog-to-digital conversion, making the microcontroller suitable for applications requiring precise sensor data acquisition.

Maximum Supply Current: 200 mA

The moderate maximum supply current requirement makes this microcontroller suitable for low-power applications and energy-efficient designs.

Nominal Supply Voltage: 1.2 V

The stable nominal supply voltage ensures consistent and reliable operation of the microcontroller, making it suitable for various electronic systems.

No. of Serial I/Os: 19

Having 19 serial I/Os allows for versatile connectivity options with external devices, expanding the capabilities of the microcontroller for communication purposes.

PWM Channels: YES

PWM channels enable precise control of analog output signals, making this microcontroller suitable for applications requiring motor control, LED dimming, and other analog signal modulation.

Connectivity: CAN(4), FSI(4), I2C(4), LIN(5), SDMMC, SPI(5), QSPI, UART(6)

The diverse connectivity options such as CAN, I2C, SPI, and UART provide flexible communication interfaces, making this microcontroller suitable for a wide range of networking and control applications.

ROM Programmability: MROM

MROM programmability offers non-volatile memory storage for essential firmware and program code, ensuring reliable operation even during power cycles or resets.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density mounting and compact PCB designs, making this microcontroller suitable for space-constrained applications.

Format: FLOATING POINT

Support for floating-point format enhances the microcontroller's capability for complex mathematical calculations, making it suitable for scientific and engineering applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, requiring standard handling procedures during storage and assembly to maintain the reliability of the microcontroller.

Speed: 400 rpm

With a speed rating of 400 rpm, this microcontroller can perform tasks quickly and efficiently, making it suitable for applications requiring high-speed processing.

Low Power Mode: YES

Low power mode feature allows the microcontroller to operate with reduced power consumption, extending battery life in portable devices and energy-efficient applications.

No. of I/O Lines: 140

Having 140 I/O lines provides ample connectivity options for interfacing with external devices and peripherals, making this microcontroller versatile for various input/output tasks.

Technical Specifications

Microcontrollers AM2632COMFHAZCZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

256KBYTES TCM MEMORY ALSO AVAILABLE

Address Bus Width:

22

Boundary Scan:

YES

CPU Family:

CORTEX-R5F

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

1

No. of I/O Lines:

140

No. of Serial I/Os:

19

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2097152

ROM Words:

0

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Speed:

400 rpm

Maximum Supply Current:

200 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

15 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(4), FSI(4), I2C(4), LIN(5), SDMMC, SPI(5), QSPI, UART(6)

Peripherals:

CAP(10), COMPARATOR(20), DMA, PWM(32), WDT

Analog To Digital Convertors:

30-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

AM2632COMFHAZCZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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