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AM2631CNDGHAZCZR

Texas Instruments

AM2631CNDGHAZCZR by Texas Instruments

Texas Instruments AM2631CNDGHAZCZR microcontroller features Cortex-R5F CPU, 22-bit address bus, 8-bit on-chip RAM, and 16-bit external data bus. With peripherals like DMA and PWM, it offers 30 ADC channels and a max clock frequency of 25 MHz. Ideal for applications requiring low power consumption and high-speed processing in automotive or industrial settings.

Median Price

$20.470

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,553 parts In-Stock

1+ parts

$11.620

100+ parts

$10.150

1k+ parts

$7.000

10k+ parts

-

3,553

$11.620

$10.150

$7.000

-

Mouser Electronics

USA . 953 parts In-Stock

1+ parts

$20.470

100+ parts

$14.190

1k+ parts

$13.050

10k+ parts

-

953

$20.470

$14.190

$13.050

-

DigiKey

USA . 860 parts In-Stock

1+ parts

$20.470

100+ parts

$14.188

1k+ parts

$11.384

10k+ parts

-

860

$20.470

$14.188

$11.384

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$7.502

100+ parts

-

1k+ parts

-

10k+ parts

-

700

$7.502

-

-

-

Digiode

USA . 2,759 parts In-Stock

1+ parts

$11.039

100+ parts

-

1k+ parts

-

10k+ parts

-

2,759

$11.039

-

-

-

VNN

France . 2,893 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,893

-

-

-

-

Vyrian

USA . 1,612 parts In-Stock

1+ parts

-

100+ parts

-

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1,612

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 333 parts In-Stock

1+ parts

$0.636

100+ parts

-

1k+ parts

-

10k+ parts

-

333

$0.636

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$7.502

100+ parts

-

1k+ parts

$7.127

10k+ parts

$6.977

2,000

$7.502

-

$7.127

$6.977

Continental Prestige Electronics

USA . 1,216 parts In-Stock

1+ parts

$7.502

100+ parts

-

1k+ parts

-

10k+ parts

$7.352

1,216

$7.502

-

-

$7.352

Semicontronic

India . 1,575 parts In-Stock

1+ parts

$7.990

100+ parts

$7.790

1k+ parts

$7.750

10k+ parts

-

1,575

$7.990

$7.790

$7.750

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Ampacity Inc.

Singapore . 1,390 parts In-Stock

1+ parts

$7.990

100+ parts

-

1k+ parts

-

10k+ parts

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1,390

$7.990

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-

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Corphita

USA . 3,930 parts In-Stock

1+ parts

$10.458

100+ parts

-

1k+ parts

-

10k+ parts

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3,930

$10.458

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-

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Microchip USA

USA . 2,861 parts In-Stock

1+ parts

$22.660

100+ parts

$22.330

1k+ parts

$22.170

10k+ parts

$22.010

2,861

$22.660

$22.330

$22.170

$22.010

Argo Parts USA

USA . 3,430 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,430

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Overview

Unleash the power of cutting-edge technology with the AM2631CNDGHAZCZR microcontroller by Texas Instruments. With a reputation for excellence in manufacturing, Texas Instruments delivers top-quality products that are sure to exceed your expectations. This versatile microcontroller is perfect for a wide range of applications, offering unmatched performance and efficiency. Experience the value and benefits of this innovative product, designed to take your projects to the next level. Elevate your work with the AM2631CNDGHAZCZR microcontroller and unlock endless possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontrollers as it provides a good balance of durability and cost-effectiveness.

Integrated Cache: YES

Having integrated cache helps in improving the speed and efficiency of data retrieval, making the product suitable for high-performance applications.

Maximum Supply Voltage: 1.26 V

The higher maximum supply voltage allows for flexibility in power supply options, accommodating various voltage levels.

Address Bus Width: 22

With a wide address bus width, this microcontroller can access a larger memory address space, enabling it to handle more complex tasks and store more data.

DAC Channels: YES

The presence of DAC channels allows the microcontroller to convert digital signals into analog voltages, enabling it to interface with analog components such as sensors and actuators.

CPU Family: CORTEX-R5F

Being part of the Cortex-R series, this microcontroller is designed for real-time applications with high performance and reliability requirements.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the peripheral IC ensures efficient execution of instructions, making the microcontroller suitable for tasks requiring fast processing.

RAM Bytes: 2097152

With a large RAM capacity, this microcontroller can handle complex algorithms and store a significant amount of data, making it suitable for memory-intensive applications.

Connectivity: CAN(4), FSI(4), I2C(4), LIN(5), SDMMC, SPI(5), QSPI, UART(6)

The wide range of connectivity options allows the microcontroller to interface with various types of external devices and communication protocols, enhancing its versatility.

No. of I/O Lines: 140

The high number of I/O lines provides ample opportunities for connecting to external peripherals and sensors, making the microcontroller suitable for complex systems with multiple inputs and outputs.

Technical Specifications

Microcontrollers AM2631CNDGHAZCZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

256KBYTES TCM MEMORY ALSO AVAILABLE

Address Bus Width:

22

Boundary Scan:

YES

CPU Family:

CORTEX-R5F

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

1

No. of I/O Lines:

140

No. of Serial I/Os:

19

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2097152

ROM Words:

0

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Speed:

400 rpm

Maximum Supply Current:

200 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

15 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(4), FSI(4), I2C(4), LIN(5), SDMMC, SPI(5), QSPI, UART(6)

Peripherals:

CAP(10), COMPARATOR(20), DMA, PWM(32), WDT

Analog To Digital Convertors:

30-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

AM2631CNDGHAZCZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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