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AM2632COLFHAZCZR

Texas Instruments

AM2632COLFHAZCZR by Texas Instruments

MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE; External Data Bus Width: 16;

Median Price

$23.250

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,945 parts In-Stock

1+ parts

$16.555

100+ parts

$14.461

1k+ parts

$9.973

10k+ parts

-

1,945

$16.555

$14.461

$9.973

-

DigiKey

USA . 901 parts In-Stock

1+ parts

$23.250

100+ parts

$16.230

1k+ parts

$14.965

10k+ parts

-

901

$23.250

$16.230

$14.965

-

Mouser Electronics

USA . 980 parts In-Stock

1+ parts

$26.060

100+ parts

$18.310

1k+ parts

$16.910

10k+ parts

-

980

$26.060

$18.310

$16.910

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,954 parts In-Stock

1+ parts

$15.727

100+ parts

-

1k+ parts

-

10k+ parts

-

4,954

$15.727

-

-

-

Vyrian

USA . 493 parts In-Stock

1+ parts

$16.555

100+ parts

-

1k+ parts

-

10k+ parts

-

493

$16.555

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 366 parts In-Stock

1+ parts

$13.390

100+ parts

-

1k+ parts

-

10k+ parts

-

366

$13.390

-

-

-

Ampacity Inc.

Singapore . 1,020 parts In-Stock

1+ parts

$14.070

100+ parts

-

1k+ parts

-

10k+ parts

-

1,020

$14.070

-

-

-

Semicontronic

India . 826 parts In-Stock

1+ parts

$14.070

100+ parts

$13.718

1k+ parts

$13.648

10k+ parts

-

826

$14.070

$13.718

$13.648

-

Corphita

USA . 3,490 parts In-Stock

1+ parts

$14.900

100+ parts

-

1k+ parts

-

10k+ parts

-

3,490

$14.900

-

-

-

Microchip USA

USA . 2,085 parts In-Stock

1+ parts

$34.010

100+ parts

$33.520

1k+ parts

$33.280

10k+ parts

$33.030

2,085

$34.010

$33.520

$33.280

$33.030

Northwest PG Solutions

USA . 774 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.353

10k+ parts

-

774

-

-

$3.353

-

Native Components

USA . 705 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.319

10k+ parts

-

705

-

-

$3.319

-

Technical Specifications

Microcontrollers AM2632COLFHAZCZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

256KBYTES TCM MEMORY ALSO AVAILABLE

Address Bus Width:

22

Boundary Scan:

YES

CPU Family:

CORTEX-R5F

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

1

No. of I/O Lines:

140

No. of Serial I/Os:

19

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2097152

ROM Words:

0

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Speed:

400 rpm

Maximum Supply Current:

200 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

15 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(4), FSI(4), I2C(4), LIN(5), SDMMC, SPI(5), QSPI, UART(6)

Peripherals:

CAP(10), COMPARATOR(20), DMA, PWM(32), WDT

Analog To Digital Convertors:

30-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

AM2632COLFHAZCZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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