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AM2631CODGHMZCZRQ1

Texas Instruments

AM2631CODGHMZCZRQ1 by Texas Instruments

AM2631CODGHMZCZRQ1 by Texas Instruments is a microcontroller with integrated cache and 8-bit on-chip data RAM. It features a max clock frequency of 25 MHz, 30-Ch 12-Bit ADC channels, and connectivity options like CAN, I2C, SPI, and UART. Ideal for applications requiring high-speed processing and multiple analog-to-digital conversions in automotive electronics or industrial control systems.

Median Price

$24.040

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,669 parts In-Stock

1+ parts

$14.210

100+ parts

$12.412

1k+ parts

$8.560

10k+ parts

-

4,669

$14.210

$12.412

$8.560

-

DigiKey

USA . 997 parts In-Stock

1+ parts

$24.040

100+ parts

$16.812

1k+ parts

$15.510

10k+ parts

-

997

$24.040

$16.812

$15.510

-

Mouser Electronics

USA . 945 parts In-Stock

1+ parts

$24.040

100+ parts

$16.820

1k+ parts

$15.400

10k+ parts

-

945

$24.040

$16.820

$15.400

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,719 parts In-Stock

1+ parts

$13.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,719

$13.500

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-

-

VNN

France . 28,153 parts In-Stock

1+ parts

-

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-

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28,153

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-

-

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Vyrian

USA . 1,991 parts In-Stock

1+ parts

-

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1,991

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Nova Conductors

Japan . 99 parts In-Stock

1+ parts

-

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99

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 543 parts In-Stock

1+ parts

$0.803

100+ parts

-

1k+ parts

-

10k+ parts

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543

$0.803

-

-

-

Ampacity Inc.

Singapore . 1,791 parts In-Stock

1+ parts

$12.080

100+ parts

-

1k+ parts

-

10k+ parts

-

1,791

$12.080

-

-

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Corphita

USA . 2,771 parts In-Stock

1+ parts

$12.789

100+ parts

-

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10k+ parts

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2,771

$12.789

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-

-

Microchip USA

USA . 2,483 parts In-Stock

1+ parts

$26.550

100+ parts

$26.170

1k+ parts

$25.990

10k+ parts

$25.800

2,483

$26.550

$26.170

$25.990

$25.800

Continental Prestige Electronics

USA . 3,188 parts In-Stock

1+ parts

-

100+ parts

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3,188

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Argo Parts USA

USA . 626 parts In-Stock

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626

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Aranea Global

USA . 100 parts In-Stock

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100+ parts

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100

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Overview

Unleash the power of innovation with the AM2631CODGHMZCZRQ1 by Texas Instruments, a cutting-edge microcontroller that redefines performance and reliability. Manufactured by a trusted industry leader, this product offers unparalleled quality and precision. Ideal for a wide range of applications, this microcontroller boasts integrated cache, advanced peripherals, and low power mode, ensuring optimal efficiency and seamless operation. Elevate your projects with the AM2631CODGHMZCZRQ1 and experience the ultimate in technology and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can withstand various environmental conditions, making the product reliable for long-term use.

Integrated Cache: YES

The integrated cache helps improve the processing speed and efficiency of the microcontroller, making it suitable for applications that require fast data access.

ADC Channels: YES

The presence of Analog-to-Digital Convertor channels allows the microcontroller to interface with analog sensors and inputs, making it versatile for a wide range of applications.

DMA Channels: YES

Direct Memory Access channels enable efficient data transfer between peripherals and memory without CPU intervention, enhancing the overall performance of the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a Reduced Instruction Set Computer (RISC) microcontroller allows for faster and more efficient processing of instructions, making the product ideal for real-time applications.

Maximum Clock Frequency: 25 MHz

The high clock frequency enables fast execution of instructions, making the microcontroller suitable for applications that require quick response times.

Connectivity: CAN(4), FSI(4), I2C(4), LIN(5), SDMMC, SPI(5), QSPI, UART(6)

The microcontroller offers a wide range of connectivity options, enabling seamless integration with various communication protocols and devices.

Technical Specifications

Microcontrollers AM2631CODGHMZCZRQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

256KBYTES TCM MEMORY ALSO AVAILABLE

Address Bus Width:

22

Boundary Scan:

YES

CPU Family:

CORTEX-R5F

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

1

No. of I/O Lines:

140

No. of Serial I/Os:

19

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2097152

ROM Words:

0

ROM Programmability:

MROM

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Speed:

400 rpm

Maximum Supply Current:

200 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

15 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(4), FSI(4), I2C(4), LIN(5), SDMMC, SPI(5), QSPI, UART(6)

Peripherals:

CAP(10), COMPARATOR(20), DMA, PWM(32), WDT

Analog To Digital Convertors:

30-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

AM2631CODGHMZCZRQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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