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AM2631CNDGHMZCZRQ1

Texas Instruments

AM2631CNDGHMZCZRQ1 by Texas Instruments

AM2631CNDGHMZCZRQ1 by Texas Instruments is a microcontroller with integrated cache and 8-bit data RAM. It features a Cortex-R5F CPU family, 30-ch ADC, and 32 PWM peripherals. Ideal for applications requiring low power consumption, such as automotive systems or industrial automation.

Median Price

$20.960

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,610 parts In-Stock

1+ parts

$13.712

100+ parts

$11.977

1k+ parts

$8.260

10k+ parts

-

1,610

$13.712

$11.977

$8.260

-

DigiKey

USA . 1,000 parts In-Stock

1+ parts

$20.960

100+ parts

$14.546

1k+ parts

$13.391

10k+ parts

-

1,000

$20.960

$14.546

$13.391

-

Mouser Electronics

USA . 4 parts In-Stock

1+ parts

$20.960

100+ parts

$14.550

1k+ parts

$13.390

10k+ parts

-

4

$20.960

$14.550

$13.390

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,475 parts In-Stock

1+ parts

$10.630

100+ parts

-

1k+ parts

-

10k+ parts

-

2,475

$10.630

-

-

-

Digiode

USA . 97 parts In-Stock

1+ parts

$13.026

100+ parts

-

1k+ parts

-

10k+ parts

-

97

$13.026

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 135 parts In-Stock

1+ parts

$10.630

100+ parts

-

1k+ parts

-

10k+ parts

-

135

$10.630

-

-

-

Ampacity Inc.

Singapore . 779 parts In-Stock

1+ parts

$11.660

100+ parts

-

1k+ parts

-

10k+ parts

-

779

$11.660

-

-

-

Semicontronic

India . 599 parts In-Stock

1+ parts

$11.660

100+ parts

$11.368

1k+ parts

$11.310

10k+ parts

-

599

$11.660

$11.368

$11.310

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Corphita

USA . 1,623 parts In-Stock

1+ parts

$12.341

100+ parts

-

1k+ parts

-

10k+ parts

-

1,623

$12.341

-

-

-

Microchip USA

USA . 1,033 parts In-Stock

1+ parts

$31.070

100+ parts

$30.620

1k+ parts

$30.400

10k+ parts

$30.180

1,033

$31.070

$30.620

$30.400

$30.180

Native Components

USA . 766 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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766

-

-

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Northwest PG Solutions

USA . 430 parts In-Stock

1+ parts

-

100+ parts

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430

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Overview

Unlock the power of cutting-edge technology with the AM2631CNDGHMZCZRQ1 microcontroller by Texas Instruments. Crafted with precision and expertise, this device offers unmatched performance and reliability for a wide range of applications. From automotive to industrial automation, this microcontroller delivers seamless connectivity and advanced features to enhance your projects. With its integrated cache and low power mode, you can expect efficient operation and extended battery life. Experience the difference with Texas Instruments and revolutionize your designs with the AM2631CNDGHMZCZRQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product lightweight and durable, which is ideal for applications where weight and robustness are important factors.

Integrated Cache: YES

Having integrated cache improves the performance of the microcontroller by reducing the access time to frequently used data and instructions, leading to faster processing speed.

Surface Mount: YES

The surface mount capability makes the product easy to install and allows for compact designs, making it suitable for space-constrained applications.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage of 1.26 V offers flexibility in power supply options, allowing for efficient power management and compatibility with various voltage sources.

On Chip Data RAM Width: 8

The 8-bit on-chip data RAM width allows for efficient data handling and processing, making the microcontroller suitable for applications requiring fast data manipulation.

Address Bus Width: 22

With a wide address bus width of 22 bits, the microcontroller can access a larger memory space, enabling it to handle complex algorithms and store more data.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures high reliability and robustness, making the microcontroller suitable for automotive and other harsh environment applications.

DAC Channels: YES

The presence of DAC channels allows the microcontroller to generate analog signals with high precision, enabling it to interface with analog sensors and actuators effectively.

No. of Terminals: 324

The large number of terminals provides ample connectivity options, allowing for versatile input/output configurations and interfacing with a wide range of external devices.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, fine pitch package style enhances the signal integrity and thermal performance of the microcontroller, making it suitable for high-speed and compact designs.

Technical Specifications

Microcontrollers AM2631CNDGHMZCZRQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

256KBYTES TCM MEMORY ALSO AVAILABLE

Address Bus Width:

22

Boundary Scan:

YES

CPU Family:

CORTEX-R5F

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

1

No. of I/O Lines:

140

No. of Serial I/Os:

19

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2097152

ROM Words:

0

ROM Programmability:

MROM

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Speed:

400 rpm

Maximum Supply Current:

200 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

15 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(4), FSI(4), I2C(4), LIN(5), SDMMC, SPI(5), QSPI, UART(6)

Peripherals:

CAP(10), COMPARATOR(20), DMA, PWM(32), WDT

Analog To Digital Convertors:

30-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

AM2631CNDGHMZCZRQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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