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AM2634COEFHAZCZR

Texas Instruments

AM2634COEFHAZCZR by Texas Instruments

AM2634COEFHAZCZR by Texas Instruments is a microcontroller with integrated cache and 22-bit address bus width. It features 30 ADC channels, 1 DAC channel, and peripherals like DMA and PWM. Ideal for applications requiring low power consumption and high-speed processing, such as industrial automation systems or automotive control units.

Median Price

$16.960

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,595 parts In-Stock

1+ parts

$16.960

100+ parts

$14.815

1k+ parts

$10.217

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$16.960

$14.815

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Mouser Electronics

USA . 1,000 parts In-Stock

1+ parts

$26.240

100+ parts

$17.530

1k+ parts

$15.360

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-

1,000

$26.240

$17.530

$15.360

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DigiKey

USA . 1,000 parts In-Stock

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$12.134

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1,000

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$12.134

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Distributors (In-Stock)

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Digiode

USA . 689 parts In-Stock

1+ parts

$16.112

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689

$16.112

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VNN

France . 2,888 parts In-Stock

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2,888

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Vyrian

USA . 1,418 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 53 parts In-Stock

1+ parts

$1.562

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53

$1.562

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Ampacity Inc.

Singapore . 1,624 parts In-Stock

1+ parts

$14.420

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1,624

$14.420

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Corphita

USA . 597 parts In-Stock

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$15.264

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597

$15.264

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Microchip USA

USA . 2,522 parts In-Stock

1+ parts

$37.560

100+ parts

$37.030

1k+ parts

$36.760

10k+ parts

$36.490

2,522

$37.560

$37.030

$36.760

$36.490

Continental Prestige Electronics

USA . 3,932 parts In-Stock

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Argo Parts USA

USA . 3,250 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Elevate your projects with the AM2634COEFHAZCZR microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability. This microcontroller is versatile, offering a wide range of applications in various industries. With integrated cache and advanced features like ADC and DAC channels, it provides unparalleled value to customers looking for high-performance solutions. Trust Texas Instruments to provide cutting-edge technology that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the microcontroller, making it suitable for various environments.

Integrated Cache: YES

The integrated cache helps in enhancing the performance of the microcontroller by storing frequently accessed data, reducing latency and improving overall speed.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation of the microcontroller onto a PCB, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage of 1.26V ensures safe operation of the microcontroller within the specified voltage range, preventing damage and ensuring reliability.

Address Bus Width: 22

With a wide address bus width of 22, this microcontroller can address a large amount of memory, enabling it to handle complex computations and data processing tasks efficiently.

DAC Channels: YES

The presence of DAC channels allows the microcontroller to convert digital signals to analog signals, making it suitable for applications that require precise analog output.

ADC Channels: YES

Having ADC channels enables the microcontroller to convert analog signals to digital signals, making it versatile for applications that require analog input data to be processed.

DMA Channels: YES

DMA channels assist in efficient data transfer between peripherals and memory without CPU intervention, enhancing overall system performance and freeing up CPU resources for other tasks.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller, it offers high performance with reduced instruction set complexity, enabling faster execution of instructions and efficient use of system resources.

PWM Channels: YES

The availability of PWM channels allows the microcontroller to generate precise pulse-width modulated signals, making it suitable for applications such as motor control and LED dimming.

Connectivity: CAN(4), FSI(4), I2C(4), LIN(5), SDMMC, SPI(5), QSPI, UART(6)

The diverse connectivity options provided by CAN, FSI, I2C, LIN, SDMMC, SPI, QSPI, and UART enable the microcontroller to communicate with a wide range of peripheral devices, making it versatile for various applications.

Technical Specifications

Microcontrollers AM2634COEFHAZCZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

256KBYTES TCM MEMORY ALSO AVAILABLE

Address Bus Width:

22

Boundary Scan:

YES

CPU Family:

CORTEX-R5F

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

1

No. of I/O Lines:

140

No. of Serial I/Os:

19

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2097152

ROM Words:

0

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Speed:

400 rpm

Maximum Supply Current:

200 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

15 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(4), FSI(4), I2C(4), LIN(5), SDMMC, SPI(5), QSPI, UART(6)

Peripherals:

CAP(10), COMPARATOR(20), DMA, PWM(32), WDT

Analog To Digital Convertors:

30-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

AM2634COEFHAZCZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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