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AM2634COKFHAZCZR

Texas Instruments

AM2634COKFHAZCZR by Texas Instruments

Texas Instruments AM2634COKFHAZCZR microcontroller features Cortex-R5F CPU, 22-bit address bus, 8-bit on-chip data RAM. With 30-Ch 12-Bit ADCs and peripherals like PWM(32) and DMA, it's ideal for applications requiring high-speed processing and precise analog-to-digital conversion. Operating b/w -40 to 105 °C, this low-profile package with 324 terminals suits compact designs needing advanced connectivity options like CAN, I2C, SPI.

Median Price

$20.950

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,868 parts In-Stock

1+ parts

$16.489

100+ parts

$14.403

1k+ parts

$9.933

10k+ parts

-

3,868

$16.489

$14.403

$9.933

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Mouser Electronics

USA . 998 parts In-Stock

1+ parts

$20.950

100+ parts

$14.550

1k+ parts

$13.380

10k+ parts

-

998

$20.950

$14.550

$13.380

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DigiKey

USA . 885 parts In-Stock

1+ parts

$20.950

100+ parts

$14.542

1k+ parts

$12.416

10k+ parts

-

885

$20.950

$14.542

$12.416

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Distributors (In-Stock)

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Digiode

USA . 1,706 parts In-Stock

1+ parts

$15.665

100+ parts

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1,706

$15.665

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Vyrian

USA . 1,660 parts In-Stock

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1,660

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VNN

France . 1,024 parts In-Stock

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Distributors (Availability)

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Corohmni

South Africa . 891 parts In-Stock

1+ parts

$1.804

100+ parts

-

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891

$1.804

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Ampacity Inc.

Singapore . 1,725 parts In-Stock

1+ parts

$14.020

100+ parts

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1,725

$14.020

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Corphita

USA . 2,123 parts In-Stock

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$14.840

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2,123

$14.840

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Microchip USA

USA . 1,457 parts In-Stock

1+ parts

$37.360

100+ parts

$36.830

1k+ parts

$36.560

10k+ parts

$36.290

1,457

$37.360

$36.830

$36.560

$36.290

Continental Prestige Electronics

USA . 6,294 parts In-Stock

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Argo Parts USA

USA . 3,631 parts In-Stock

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3,631

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Elevate your projects with the AM2634COKFHAZCZR by Texas Instruments, a high-quality microcontroller designed to deliver top-notch performance and reliability. With a wide range of applications in various industries, this innovative product boasts integrated cache and advanced features that set it apart from the competition. Experience seamless connectivity and efficient data processing with Texas Instruments' cutting-edge technology. Unlock endless possibilities and take your projects to the next level with the AM2634COKFHAZCZR.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

This material is cost-effective, lightweight, and durable, making the product suitable for various applications.

Integrated Cache - YES

The integrated cache helps improve the overall performance and efficiency of the microcontroller.

Maximum Supply Voltage - 1.26 V

Having a maximum supply voltage of 1.26V ensures reliable and safe operation within specified limits.

ADC Channels - YES

The presence of ADC channels allows for analog signal inputs to be converted to digital, enhancing the versatility of the microcontroller.

DMA Channels - YES

DMA channels enable efficient data transfer and processing, improving the overall performance of the microcontroller.

Digital To Analog Convertors - 1-Ch 12-Bit

The DAC with 1 channel and 12-bit resolution enables accurate conversion of digital signals to analog, useful in various applications.

Peripheral IC Type - MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers enhanced performance and efficiency in executing instructions, making it a reliable choice for embedded systems.

Technical Specifications

Microcontrollers AM2634COKFHAZCZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

256KBYTES TCM MEMORY ALSO AVAILABLE

Address Bus Width:

22

Boundary Scan:

YES

CPU Family:

CORTEX-R5F

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

1

No. of I/O Lines:

140

No. of Serial I/Os:

19

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2097152

ROM Words:

0

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Speed:

400 rpm

Maximum Supply Current:

200 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

15 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(4), FSI(4), I2C(4), LIN(5), SDMMC, SPI(5), QSPI, UART(6)

Peripherals:

CAP(10), COMPARATOR(20), DMA, PWM(32), WDT

Analog To Digital Convertors:

30-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

AM2634COKFHAZCZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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