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AM2632CNEFHAZCZR

Texas Instruments

AM2632CNEFHAZCZR by Texas Instruments

The Texas Instruments AM2632CNEFHAZCZR microcontroller features a Cortex-R5F CPU, 22-bit address bus, and 30-Ch 12-Bit ADC. With peripherals like CAN, I2C, and UART, it's ideal for applications requiring high-speed data processing in automotive systems or industrial automation. Operating b/w -40 to 105 °C with low power mode support makes it versatile for various environments.

Median Price

$15.347

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,537 parts In-Stock

1+ parts

$15.347

100+ parts

$13.405

1k+ parts

$9.245

10k+ parts

-

1,537

$15.347

$13.405

$9.245

-

Mouser Electronics

USA . 1,000 parts In-Stock

1+ parts

$27.140

100+ parts

$18.130

1k+ parts

$15.890

10k+ parts

-

1,000

$27.140

$18.130

$15.890

-

DigiKey

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$10.559

10k+ parts

-

2,000

-

-

$10.559

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,021 parts In-Stock

1+ parts

$9.748

100+ parts

-

1k+ parts

-

10k+ parts

-

1,021

$9.748

-

-

-

Digiode

USA . 2,652 parts In-Stock

1+ parts

$14.580

100+ parts

-

1k+ parts

-

10k+ parts

-

2,652

$14.580

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 32 parts In-Stock

1+ parts

$0.089

100+ parts

-

1k+ parts

-

10k+ parts

$0.086

32

$0.089

-

-

$0.086

Northwest PG Solutions

USA . 1,412 parts In-Stock

1+ parts

$0.098

100+ parts

-

1k+ parts

-

10k+ parts

$0.087

1,412

$0.098

-

-

$0.087

Ampacity Inc.

Singapore . 1,494 parts In-Stock

1+ parts

$8.290

100+ parts

-

1k+ parts

-

10k+ parts

-

1,494

$8.290

-

-

-

Semicontronic

India . 1,370 parts In-Stock

1+ parts

$8.290

100+ parts

$8.083

1k+ parts

$8.041

10k+ parts

-

1,370

$8.290

$8.083

$8.041

-

Corohmni

South Africa . 341 parts In-Stock

1+ parts

$9.748

100+ parts

-

1k+ parts

-

10k+ parts

-

341

$9.748

-

-

-

Corphita

USA . 903 parts In-Stock

1+ parts

$13.812

100+ parts

-

1k+ parts

-

10k+ parts

-

903

$13.812

-

-

-

Microchip USA

USA . 1,242 parts In-Stock

1+ parts

$34.770

100+ parts

$34.280

1k+ parts

$34.030

10k+ parts

$33.780

1,242

$34.770

$34.280

$34.030

$33.780

Overview

Unlock the power of cutting-edge technology with the AM2632CNEFHAZCZR microcontroller from Texas Instruments. Designed with precision and expertise, this device offers unparalleled performance and reliability in a wide range of applications. With integrated cache, digital-to-analog converters, and advanced peripherals, this microcontroller delivers exceptional value and versatility. Whether you're working on industrial automation, automotive systems, or consumer electronics, the AM2632CNEFHAZCZR is the perfect choice for your next project. Experience the quality and innovation that Texas Instruments is known for with this top-of-the-line microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for various applications.

Integrated Cache: YES

The integrated cache helps improve performance by storing frequently accessed data for quick retrieval.

Surface Mount: YES

Surface mount technology allows for easy and compact PCB assembly, saving space in the design.

Maximum Supply Voltage: 1.26 V

Efficient power management with a relatively low maximum supply voltage.

On Chip Data RAM Width: 8

The wide data RAM width allows for efficient data processing and storage on the chip.

Address Bus Width: 22

A wide address bus width enables the processor to access a large memory space, improving overall performance.

DAC Channels: YES

Digital-to-analog converter channels enable the microcontroller to interface with analog components, expanding its connectivity options.

ADC Channels: YES

Analog-to-digital converter channels allow the microcontroller to read analog signals, making it suitable for sensor interfacing and measurement applications.

DMA Channels: YES

Direct Memory Access channels facilitate data transfer between peripherals and memory without CPU intervention, improving overall system efficiency.

External Data Bus Width: 16

The wide external data bus width allows for fast data transfer between the microcontroller and external memory or peripherals.

Peripherals: CAP(10), COMPARATOR(20), DMA, PWM(32), WDT

A wide range of peripherals including capacitors, comparators, PWM channels, and watchdog timers enhance the microcontroller's functionality and versatility.

Connectivity: CAN(4), FSI(4), I2C(4), LIN(5), SDMMC, SPI(5), QSPI, UART(6)

Multiple connectivity options such as CAN, I2C, SPI, UART, etc., enable the microcontroller to communicate with a variety of devices and interface with different communication protocols.

No. of I/O Lines: 140

A high number of I/O lines provide ample interfacing options for connecting external components, sensors, and peripherals to the microcontroller.

Technical Specifications

Microcontrollers AM2632CNEFHAZCZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

256KBYTES TCM MEMORY ALSO AVAILABLE

Address Bus Width:

22

Boundary Scan:

YES

CPU Family:

CORTEX-R5F

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

1

No. of I/O Lines:

140

No. of Serial I/Os:

19

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2097152

ROM Words:

0

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Speed:

400 rpm

Maximum Supply Current:

200 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

15 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(4), FSI(4), I2C(4), LIN(5), SDMMC, SPI(5), QSPI, UART(6)

Peripherals:

CAP(10), COMPARATOR(20), DMA, PWM(32), WDT

Analog To Digital Convertors:

30-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

AM2632CNEFHAZCZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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