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AM2634COKFHMZCZRQ1

Texas Instruments

AM2634COKFHMZCZRQ1 by Texas Instruments

Texas Instruments AM2634COKFHMZCZRQ1 microcontroller features Cortex-R5F CPU, 22-bit address bus, 8-bit on-chip data RAM. With 30 ADC channels and 1 DAC channel, it's ideal for automotive applications requiring CAN, FSI, I2C, LIN connectivity and low power mode. Operating at max clock frequency of 25 MHz with peripherals like PWM(32) and DMA support.

Median Price

$25.468

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,640 parts In-Stock

1+ parts

$19.316

100+ parts

$16.872

1k+ parts

$11.636

10k+ parts

-

5,640

$19.316

$16.872

$11.636

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Mouser Electronics

USA . 480 parts In-Stock

1+ parts

$31.620

100+ parts

$23.630

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-

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480

$31.620

$23.630

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-

Distributors (In-Stock)

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Digiode

USA . 3,557 parts In-Stock

1+ parts

$18.350

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3,557

$18.350

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Vyrian

USA . 6,396 parts In-Stock

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6,396

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VNN

France . 656 parts In-Stock

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656

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Nova Conductors

Japan . 600 parts In-Stock

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600

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Distributors (Availability)

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Corohmni

South Africa . 9 parts In-Stock

1+ parts

$1.551

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-

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9

$1.551

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Ampacity Inc.

Singapore . 2,197 parts In-Stock

1+ parts

$16.420

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2,197

$16.420

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Semicontronic

India . 2,172 parts In-Stock

1+ parts

$16.420

100+ parts

$16.010

1k+ parts

$15.927

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2,172

$16.420

$16.010

$15.927

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Corphita

USA . 1,507 parts In-Stock

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$17.384

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1,507

$17.384

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Argo Parts USA

USA . 4,671 parts In-Stock

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4,671

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Continental Prestige Electronics

USA . 3,836 parts In-Stock

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3,836

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Bastille Electronics

Australia . 49 parts In-Stock

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49

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Overview

Experience seamless performance and reliability with the AM2634COKFHMZCZRQ1 microcontroller from Texas Instruments, a trusted leader in the industry. Perfect for a wide range of applications, this advanced device offers integrated cache, high-quality construction, and a multitude of peripherals. Get ready to unlock endless possibilities with its innovative features such as DAC and ADC channels, DMA capabilities, and a maximum clock frequency of 25 MHz. Elevate your projects to new heights with the AM2634COKFHMZCZRQ1 microcontroller and experience unparalleled value and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the microcontroller, making it suitable for a wide range of applications.

Integrated Cache: YES

Having an integrated cache improves data access speed and overall performance of the microcontroller, making it efficient for handling complex tasks.

Maximum Supply Voltage: 1.26 V

The high maximum supply voltage allows for flexibility in power input options, enabling the microcontroller to work effectively in various power supply environments.

On Chip Data RAM Width: 8

With a wide data RAM width, the microcontroller can handle large volumes of data simultaneously, enhancing its processing capabilities.

Address Bus Width: 22

A wide address bus width allows the microcontroller to access a large memory space efficiently, enabling it to store and retrieve data quickly.

Screening Level: AEC-Q100

This screening level ensures that the microcontroller meets automotive industry standards for reliability and performance, making it suitable for automotive applications.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to interface with analog sensors and devices, expanding its capabilities for a wider range of applications.

No. of Terminals: 324

Having a high number of terminals provides more connectivity options for peripherals and external devices, making the microcontroller versatile and adaptable to different systems.

DMA Channels: YES

DMA channels allow for efficient data transfer between peripherals and memory without involving the CPU, freeing up processing power for other tasks and improving overall system performance.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC architecture microcontroller, it offers high performance and energy efficiency, making it suitable for applications that require fast and reliable processing.

Technical Specifications

Microcontrollers AM2634COKFHMZCZRQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

256KBYTES TCM MEMORY ALSO AVAILABLE

Address Bus Width:

22

Boundary Scan:

YES

CPU Family:

CORTEX-R5F

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

1

No. of I/O Lines:

140

No. of Serial I/Os:

19

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2097152

ROM Words:

0

ROM Programmability:

MROM

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Speed:

400 rpm

Maximum Supply Current:

200 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

15 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(4), FSI(4), I2C(4), LIN(5), SDMMC, SPI(5), QSPI, UART(6)

Peripherals:

CAP(10), COMPARATOR(20), DMA, PWM(32), WDT

Analog To Digital Convertors:

30-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

AM2634COKFHMZCZRQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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