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AM2634COMFHAZCZR

Texas Instruments

AM2634COMFHAZCZR by Texas Instruments

AM2634COMFHAZCZR by Texas Instruments is a microcontroller with integrated cache and surface mount capability. It has a max supply voltage of 1.26V and is suitable for applications such as CAN, FSI, I2C, LIN, SDMMC, SPI, QSPI, and UART connectivity.

Median Price

$29.990

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,528 parts In-Stock

1+ parts

$21.671

100+ parts

$18.930

1k+ parts

$13.055

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$21.671

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$13.055

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DigiKey

USA . 1,634 parts In-Stock

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$29.990

100+ parts

$21.230

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$19.651

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1,634

$29.990

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$19.651

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Mouser Electronics

USA . 434 parts In-Stock

1+ parts

$33.040

100+ parts

$23.520

1k+ parts

$21.790

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434

$33.040

$23.520

$21.790

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Distributors (In-Stock)

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Digiode

USA . 4,111 parts In-Stock

1+ parts

$20.587

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VNN

France . 4,084 parts In-Stock

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Vyrian

USA . 2,857 parts In-Stock

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Nova Conductors

Japan . 67 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 391 parts In-Stock

1+ parts

$1.760

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391

$1.760

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Semicontronic

India . 3,087 parts In-Stock

1+ parts

$18.420

100+ parts

$17.960

1k+ parts

$17.867

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3,087

$18.420

$17.960

$17.867

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Ampacity Inc.

Singapore . 3,040 parts In-Stock

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$18.420

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$18.420

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Corphita

USA . 2,365 parts In-Stock

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$19.504

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Microchip USA

USA . 2,637 parts In-Stock

1+ parts

$45.990

100+ parts

$45.330

1k+ parts

$45.000

10k+ parts

$44.670

2,637

$45.990

$45.330

$45.000

$44.670

Continental Prestige Electronics

USA . 4,828 parts In-Stock

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Argo Parts USA

USA . 4,409 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Experience high-quality performance and reliability with the AM2634COMFHAZCZR microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments has a strong reputation for manufacturing top-notch products. The AM2634COMFHAZCZR is perfect for various applications, offering customers exceptional value and advantages. With its integrated cache and advanced technology, this microcontroller delivers unparalleled speed and efficiency. Whether you need precise analog to digital conversion or reliable connectivity options, the AM2634COMFHAZCZR has it all. Unlock your creativity and take your projects to new heights with this versatile and powerful microcontroller from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material makes the product lightweight and durable, ideal for portable applications.

Integrated Cache: YES

Having an integrated cache helps improve the processing speed and efficiency of the microcontroller.

Surface Mount: YES

Allows for easy mounting on PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.26 V

Operates efficiently within a specified voltage range, ensuring stability and performance.

On Chip Data RAM Width: 8

Wide data RAM width allows for faster data processing and multitasking capabilities.

Address Bus Width: 22

Wide address bus width enables access to a large memory space, enhancing the microcontroller's capabilities.

Package Shape: SQUARE

Square shape allows for efficient use of space on the PCB.

DAC Channels: YES

Digital-to-Analog Converter channels enable the microcontroller to interface with analog sensors and devices.

No. of Terminals: 324

Ample number of terminals provide flexibility for connecting various components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style offers high component density, low profile for slim designs, and fine pitch for compactness.

Minimum Supply Voltage: 1.14 V

Operates at low voltage, reducing power consumption and heat generation.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliability and performance in harsh environments.

CPU Family: CORTEX-R5F

Belongs to the efficient and high-performance Cortex-R5F CPU family, ensuring reliability and speed in processing.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely low temperatures, making it suitable for a wide range of environments.

ADC Channels: YES

Analog-to-Digital Converter channels enable the microcontroller to read data from analog sensors with accuracy.

DMA Channels: YES

Direct Memory Access channels help in offloading data transfer tasks from the CPU, improving overall system efficiency.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure connection to the PCB.

Maximum Seated Height: 1.4 mm

Low maximum seated height enables the microcontroller to be used in slim and compact devices.

Digital To Analog Convertors: 1-Ch 12-Bit

Offers high-quality digital-to-analog conversion with 12-bit resolution for accurate analog outputs.

Width: 15 mm

Compact width enables the microcontroller to be used in space-constrained applications.

Boundary Scan: YES

Boundary scan feature facilitates testing and debugging of the microcontroller during manufacturing.

External Data Bus Width: 16

Wide external data bus width allows for efficient data transfer between the microcontroller and external memory.

Peripherals: CAP(10), COMPARATOR(20), DMA, PWM(32), WDT

A wide range of peripherals enhances the microcontroller's capabilities for various application requirements.

Maximum Clock Frequency: 25 MHz

Operates at a high clock frequency for fast processing speed and real-time applications.

Peak Reflow Temperature °C: 260

Sustains high reflow temperatures during assembly processes, ensuring robustness and reliability.

Length: 15 mm

Compact length makes the microcontroller suitable for small form factor devices.

Peripheral IC Type: MICROCONTROLLER, RISC

Belongs to the advanced RISC architecture, offering high performance and efficiency in processing.

RAM Bytes: 2097152

Large RAM capacity provides ample memory for data storage and processing, enhancing the microcontroller's capabilities.

Technology: CMOS

CMOS technology ensures low power consumption, high speed, and reliability in operation.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and ease of soldering during assembly.

Analog To Digital Convertors: 30-Ch 12-Bit

Wide range of Analog-to-Digital Converter channels with high resolution for accurate analog-to-digital conversion.

Maximum Supply Current: 200 mA

Operates within a specified current range, ensuring stable performance and efficiency.

Nominal Supply Voltage: 1.2 V

Nominal supply voltage ensures consistent and stable power supply to the microcontroller.

No. of Serial I/Os: 19

Sufficient number of serial I/O interfaces for communication with external devices and peripherals.

PWM Channels: YES

Pulse Width Modulation channels enable precise control over analog signals, suitable for motor control and dimming applications.

Connectivity: CAN(4), FSI(4), I2C(4), LIN(5), SDMMC, SPI(5), QSPI, UART(6)

Versatile connectivity options for interfacing with a wide range of communication protocols and devices.

ROM Programmability: MROM

MROM (Mask ROM) programmability ensures secure and permanent storage of firmware and boot code.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for compact packaging and efficient use of PCB space.

Format: FLOATING POINT

Supports floating-point operations, providing high precision in mathematical calculations.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level indicates how sensitive the microcontroller is to moisture during storage and handling.

Speed: 400 rpm

Operates at a high speed of 400 revolutions per minute, suitable for applications requiring quick response times.

Low Power Mode: YES

Low power mode feature helps in reducing power consumption during idle or low load conditions, prolonging battery life in portable devices.

No. of I/O Lines: 140

Abundant number of I/O lines for connecting to external peripherals and sensors, making the microcontroller versatile and adaptable to different applications.

Technical Specifications

Microcontrollers AM2634COMFHAZCZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

256KBYTES TCM MEMORY ALSO AVAILABLE

Address Bus Width:

22

Boundary Scan:

YES

CPU Family:

CORTEX-R5F

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

1

No. of I/O Lines:

140

No. of Serial I/Os:

19

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2097152

ROM Words:

0

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Speed:

400 rpm

Maximum Supply Current:

200 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

15 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(4), FSI(4), I2C(4), LIN(5), SDMMC, SPI(5), QSPI, UART(6)

Peripherals:

CAP(10), COMPARATOR(20), DMA, PWM(32), WDT

Analog To Digital Convertors:

30-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

AM2634COMFHAZCZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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