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AM1707DZKBA3

Texas Instruments

AM1707DZKBA3 by Texas Instruments

AM1707DZKBA3 by Texas Instruments is a 32-bit microprocessor with integrated cache and 8-bit on-chip data RAM. It operates at a max clock frequency of 30 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. With a package style of grid array and fine pitch, it offers 172032 RAM words and supports up to 40 DMA channels.

Median Price

$14.043

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 181 parts In-Stock

1+ parts

$13.486

100+ parts

$11.780

1k+ parts

$8.124

10k+ parts

-

181

$13.486

$11.780

$8.124

-

Rochester

USA . 189 parts In-Stock

1+ parts

-

100+ parts

$11.680

1k+ parts

$10.450

10k+ parts

$9.830

189

-

$11.680

$10.450

$9.830

DigiKey

USA . 189 parts In-Stock

1+ parts

-

100+ parts

$15.360

1k+ parts

-

10k+ parts

-

189

-

$15.360

-

-

Verical

USA . 189 parts In-Stock

1+ parts

-

100+ parts

$14.600

1k+ parts

$13.063

10k+ parts

$12.287

189

-

$14.600

$13.063

$12.287

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 338 parts In-Stock

1+ parts

$10.716

100+ parts

-

1k+ parts

-

10k+ parts

-

338

$10.716

-

-

-

Vyrian

USA . 6,744 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,744

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,419 parts In-Stock

1+ parts

$10.152

100+ parts

-

1k+ parts

-

10k+ parts

-

2,419

$10.152

-

-

-

Microchip USA

USA . 2,053 parts In-Stock

1+ parts

$32.840

100+ parts

$32.370

1k+ parts

$32.140

10k+ parts

$31.910

2,053

$32.840

$32.370

$32.140

$31.910

Advanced Electronics

New Zealand . 550 parts In-Stock

1+ parts

$39.148

100+ parts

$35.625

1k+ parts

$32.101

10k+ parts

-

550

$39.148

$35.625

$32.101

-

Corohmni

South Africa . 285 parts In-Stock

1+ parts

$71.050

100+ parts

-

1k+ parts

-

10k+ parts

-

285

$71.050

-

-

-

Parana Technologies

USA . 341 parts In-Stock

1+ parts

$76.608

100+ parts

-

1k+ parts

-

10k+ parts

-

341

$76.608

-

-

-

ChromeModa Solutions

Germany . 6,515 parts In-Stock

1+ parts

$86.076

100+ parts

$70.582

1k+ parts

-

10k+ parts

-

6,515

$86.076

$70.582

-

-

IDEA Electronic Components Group

UK . 1,750 parts In-Stock

1+ parts

$86.076

100+ parts

$81.772

1k+ parts

$77.468

10k+ parts

-

1,750

$86.076

$81.772

$77.468

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Native Components

USA . 251 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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251

-

-

-

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DigiPath Technology Company

USA . 229 parts In-Stock

1+ parts

-

100+ parts

$77.606

1k+ parts

-

10k+ parts

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229

-

$77.606

-

-

Perfect Parts

USA . 202 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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202

-

-

-

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Northwest PG Solutions

USA . 60 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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60

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Overview

Discover the unparalleled performance and reliability of the Texas Instruments AM1707DZKBA3 microprocessor. As a trusted manufacturer in the industry, Texas Instruments delivers cutting-edge technology with integrated cache and a wide range of power supplies. Ideal for industrial applications, this product offers high-speed processing and low power consumption, making it a valuable choice for customers seeking top-notch performance in their projects. Upgrade your system with the AM1707DZKBA3 and experience the quality and innovation that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and thermal stability to the microprocessor, ensuring reliable performance.

Integrated Cache: YES

The integrated cache helps in improving the performance of the processor by reducing the average time to access memory.

Maximum Supply Voltage: 1.32 V

The lower maximum supply voltage contributes to energy efficiency and potentially longer battery life in mobile devices.

On Chip Data RAM Width: 8

The wider data RAM width allows for faster data processing and improved performance.

Address Bus Width: 13

The wider address bus width enables the processor to access a larger memory space, enhancing its capabilities.

Bit Size: 32

The 32-bit architecture allows the processor to handle larger amounts of data at once, improving overall processing speed.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature makes this microprocessor suitable for industrial applications where heat dissipation is a concern.

Peripheral IC Type: MICROPROCESSOR, RISC

The RISC architecture in the peripheral IC type enhances the speed and efficiency of the microprocessor, making it a good choice for high-performance applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable.

Technical Specifications

Microprocessors AM1707DZKBA3 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

13

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

40

No. of Terminals:

256

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

RAM Words:

172032

Maximum Seated Height:

2.05 mm

Speed:

375 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM1707DZKBA3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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