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AM1707DZKB4

Texas Instruments

AM1707DZKB4 by Texas Instruments

The Texas Instruments AM1707DZKB4 microprocessor features 32-bit architecture, 8-word data RAM width, and a max clock frequency of 30 MHz. Ideal for applications requiring low power consumption, such as embedded systems and IoT devices.

Median Price

$15.784

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 523 parts In-Stock

1+ parts

$12.138

100+ parts

$10.602

1k+ parts

$7.312

10k+ parts

-

523

$12.138

$10.602

$7.312

-

Mouser Electronics

USA . 4 parts In-Stock

1+ parts

$19.430

100+ parts

$13.370

1k+ parts

$13.200

10k+ parts

-

4

$19.430

$13.370

$13.200

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,098 parts In-Stock

1+ parts

$11.531

100+ parts

-

1k+ parts

-

10k+ parts

-

1,098

$11.531

-

-

-

Vyrian

USA . 4,285 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,285

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,173 parts In-Stock

1+ parts

$10.924

100+ parts

-

1k+ parts

-

10k+ parts

-

2,173

$10.924

-

-

-

Parana Technologies

USA . 1,934 parts In-Stock

1+ parts

$31.333

100+ parts

$2,909.776

1k+ parts

$28.200

10k+ parts

-

1,934

$31.333

$2,909.776

$28.200

-

Microchip USA

USA . 2,822 parts In-Stock

1+ parts

$33.710

100+ parts

$33.220

1k+ parts

$32.980

10k+ parts

$32.740

2,822

$33.710

$33.220

$32.980

$32.740

DigiPath Technology Company

USA . 1,715 parts In-Stock

1+ parts

$34.502

100+ parts

$31.742

1k+ parts

-

10k+ parts

-

1,715

$34.502

$31.742

-

-

ChromeModa Solutions

Germany . 675 parts In-Stock

1+ parts

$35.206

100+ parts

$28.869

1k+ parts

-

10k+ parts

-

675

$35.206

$28.869

-

-

IDEA Electronic Components Group

UK . 631 parts In-Stock

1+ parts

$35.206

100+ parts

$33.446

1k+ parts

$31.685

10k+ parts

-

631

$35.206

$33.446

$31.685

-

Northwest PG Solutions

USA . 2,092 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,092

-

-

-

-

Native Components

USA . 83 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

83

-

-

-

-

Overview

Unleash the power of the AM1707DZKB4 by Texas Instruments and experience unparalleled performance and reliability in a compact package. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality microprocessors that are perfect for a wide range of applications. Whether you're looking to enhance your smart devices or boost your industrial automation systems, this product offers exceptional value, efficiency, and speed. Trust Texas Instruments to provide cutting-edge technology that meets all your computing needs. Elevate your projects with the AM1707DZKB4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection to the microprocessor, ensuring long-term reliability.

Integrated Cache: YES

Integrated cache improves the processing speed and efficiency of the microprocessor by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 1.32 V

Operating within the specified maximum supply voltage ensures stable performance and prevents damage to the microprocessor.

On Chip Data RAM Width: 8

8-bit data RAM width allows for efficient data processing and storage within the microprocessor.

Address Bus Width: 13

A 13-bit address bus width enables the microprocessor to access a larger memory space, increasing its capabilities for handling complex tasks.

Package Shape: SQUARE

Square package shape provides a compact form factor, making it suitable for applications where space is limited.

Bit Size: 32

32-bit microprocessor architecture enables the handling of larger data sets and improves overall performance.

Power Supplies (V): 1.3,1.8/3.3

Multiple power supply options allow for flexible voltage input, catering to different power requirements in various applications.

No. of Terminals: 256

Having 256 terminals provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array and fine pitch package style ensure secure and reliable connections, enhancing the overall durability of the microprocessor.

Minimum Supply Voltage: 1.14 V

Operating above the minimum supply voltage ensures proper functionality and prevents voltage-related issues in the microprocessor.

Maximum Operating Temperature: 90 °C

With a maximum operating temperature of 90°C, the microprocessor can maintain stable performance even under high temperature conditions.

Minimum Operating Temperature: 0 °C

The microprocessor can operate effectively even at low temperatures, making it suitable for use in various environments.

Terminal Finish: TIN SILVER COPPER

Tin, silver, and copper terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy mounting and installation of the microprocessor on a circuit board.

Maximum Seated Height: 2.05 mm

Low seated height allows for a slim profile, making the microprocessor suitable for compact device designs.

RAM Words: 172032

Having 172032 RAM words provides sufficient memory capacity for storing and accessing data during processing.

Width: 17 mm

17mm width offers a balance between compact size and efficient design, making the microprocessor versatile for different applications.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the microprocessor during manufacturing and maintenance.

External Data Bus Width: 16

16-bit external data bus width provides faster data transfer rates and improves overall performance of the microprocessor.

Maximum Clock Frequency: 30 MHz

Operating at a maximum clock frequency of 30 MHz enables high-speed processing and responsiveness in the microprocessor.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the microprocessor can withstand reflow soldering processes without damage.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures proper soldering and secure attachment of the microprocessor to the circuit board.

Length: 17 mm

17mm length contributes to the overall compactness of the microprocessor, making it suitable for space-constrained designs.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC (Reduced Instruction Set Computing) architecture in a microprocessor enhances efficiency and performance by simplifying instructions for faster execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form provides secure connections and easy soldering during installation of the microprocessor on a circuit board.

Nominal Supply Voltage: 1.2 V

Operating at a nominal supply voltage of 1.2 V ensures stable performance and energy efficiency in the microprocessor.

No. of DMA Channels: 40

Having 40 DMA channels enables efficient data transfer and processing within the microprocessor, enhancing its overall performance.

Terminal Pitch: 0.5 mm

Terminal pitch of 0.5 mm allows for fine-pitch connections, ensuring secure and reliable interfacing with other components.

Format: FIXED POINT

Fixed-point format in the microprocessor facilitates efficient mathematical calculations and data processing, suitable for a wide range of applications.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates that the microprocessor can withstand moderate humidity levels without damage, ensuring reliability in various environments.

Speed: 456 rpm

Operating at a speed of 456 rpm, the microprocessor delivers efficient performance for processing data and executing instructions.

Low Power Mode: YES

Low power mode feature allows the microprocessor to conserve energy when idle or under low-load conditions, increasing overall energy efficiency.

Technical Specifications

Microprocessors AM1707DZKB4 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

13

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

40

No. of Terminals:

256

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8/3.3

Qualification:

Not Qualified

RAM Words:

172032

Maximum Seated Height:

2.05 mm

Speed:

456 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM1707DZKB4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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