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74ALVCH16271DLRG4

Texas Instruments

74ALVCH16271DLRG4 by Texas Instruments

The Texas Instruments 74ALVCH16271DLRG4 is a 12-function multiplexer with a supply voltage of 1.8V, operating temperature range of -40 to 85°C, and propagation delay of 6.2ns. It is ideal for industrial applications requiring high-speed signal switching in compact designs with surface-mount capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,199 parts In-Stock

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Digiode

USA . 1,535 parts In-Stock

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1,535

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Native Components

USA . 105 parts In-Stock

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$1.617

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105

$1.617

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Northwest PG Solutions

USA . 1,349 parts In-Stock

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$1.779

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$1.779

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AZTECH Wire

Italy . 618 parts In-Stock

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$13.295

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618

$13.295

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Parana Technologies

USA . 1,002 parts In-Stock

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$25.320

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$2,351.310

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$22.788

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1,002

$25.320

$2,351.310

$22.788

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DigiPath Technology Company

USA . 1,447 parts In-Stock

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$27.880

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$27.880

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ChromeModa Solutions

Germany . 6,602 parts In-Stock

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$28.449

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$23.328

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$28.449

$23.328

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IDEA Electronic Components Group

UK . 1,082 parts In-Stock

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$28.449

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$27.027

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$25.604

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1,082

$28.449

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One Stop Electronics

USA . 881 parts In-Stock

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$55.000

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881

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Corphita

USA . 1,990 parts In-Stock

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Microchip USA

USA . 105 parts In-Stock

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Overview

Looking for a reliable and high-quality Multiplexer & Demultiplexer? Look no further than the 74ALVCH16271DLRG4 by Texas Instruments. With its advanced technology and industrial-grade design, this versatile component offers unmatched performance and reliability for a wide range of applications. From data transmission to signal processing, this product is designed to meet your needs with ease. Discover the value and benefits that Texas Instruments brings to your projects with the 74ALVCH16271DLRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Surface Mount: YES

The surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

No. of Functions: 12

Having 12 functions in one device increases efficiency and reduces the need for multiple components, saving cost and board space.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low nominal supply voltage of 1.8V helps in reducing power consumption and heat dissipation, making it energy-efficient.

Propagation Delay (tpd): 6.2 ns

With a low propagation delay of 6.2 ns, the device ensures fast signal processing, making it suitable for high-speed applications.

Temperature Grade: INDUSTRIAL

Being industrial-grade, the device can operate efficiently in a wide range of temperature conditions, making it reliable for industrial applications.

Technology: CMOS

Using CMOS technology allows for low power consumption, high noise immunity, and compatibility with a wide range of voltage levels, making it versatile and efficient.

Technical Specifications

Multiplexer & Demultiplexer 74ALVCH16271DLRG4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G56

Length:

18.415 mm

No. of Functions:

12

No. of Inputs:

1

No. of Outputs:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8/3.3

Propagation Delay (tpd):

6.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.49 mm

Trade Compliance

74ALVCH16271DLRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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