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74ALS251D

NXP Semiconductors

74ALS251D by NXP Semiconductors

74ALS251D by NXP Semiconductors is a TTL multiplexer with 8 inputs and a propagation delay of just 16 ns. It operates at a nominal voltage of 5V, supporting commercial applications in compact designs. Its small outline package ensures efficient surface mounting.

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GES GmbH

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One Stop Electronics

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UNI Independent Distributors

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Overview

Unlock the potential of your designs with the 74ALS251D from NXP Semiconductors, a trusted leader in high-quality electronics. This versatile multiplexer/demultiplexer seamlessly integrates into a range of applications, delivering reliable performance and enhanced efficiency. With its compact size and robust features, it ensures optimal data routing while saving valuable board space. Elevate your projects with NXP's commitment to innovation and quality—your path to success starts here!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and reliability, making the product suitable for various electronic applications.

Surface Mount: YES

Surface mount capability allows for efficient use of board space and simplifies the assembly process in manufacturing.

No. of Inputs: 8

With 8 inputs, this multiplexer/demultiplexer provides versatility for integrating multiple signals, enhancing its functionality.

Package Shape: RECTANGULAR

The rectangular shape can facilitate easier design and layout on PCBs, optimizing space and organization.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V ensures compatibility with a wide range of digital logic systems, simplifying design considerations.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF allows the multiplexer to handle typical signal loads effectively, ensuring signal integrity.

No. of Terminals: 16

With 16 terminals, it supports intricate circuit designs and allows for more functionalities within a compact package.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes footprint, making it ideal for space-constrained applications.

Propagation Delay (tpd): 16 ns

A propagation delay of 16 ns ensures fast signal switching, making the device suitable for high-speed applications.

Maximum Operating Temperature: 70 °C

Withstanding up to 70 °C makes it reliable for use in environments with moderate heat, suitable for commercial applications.

Output Characteristics: 3-STATE

3-state output provides flexibility in bus systems, allowing for multiple devices to share the same communication lines.

Minimum Operating Temperature: 0 °C

Operation from 0 °C ensures functionality in a wider range of environmental conditions, enhancing reliability.

Terminal Position: DUAL

Dual terminal position aids in layout versatility, offering more design options for PCB engineers.

Maximum Seated Height: 1.75 mm

A low profile of 1.75 mm is advantageous for compact designs, ensuring compatibility with modern low-height components.

Width: 3.9 mm

A narrow width allows for high-density layouts, making it easier to incorporate multiple components in a limited space.

Output Polarity: COMPLEMENTARY

Complementary output allows for more flexible design applications where signal inversion might be required.

Minimum Supply Voltage (Vsup): 4.5 V

The ability to operate at a minimum supply voltage of 4.5V enhances the device's range of compatibility with different designs.

Length: 9.9 mm

A compact length is ideal for integration into smaller systems without sacrificing functionality.

Temperature Grade: COMMERCIAL

Commercial temperature grade assures reliability for general use, making it suitable for standard electronics.

Technology: TTL

Using TTL technology ensures compatibility with a vast range of integrated circuits, enhancing integration in legacy systems.

Terminal Form: GULL WING

Gull wing terminals provide a reliable soldering method and excellent electrical connection quality.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, it provides a balance between pin density and manufacturability, facilitating easier assembly.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V provides a safe operating range to prevent damage during unexpected voltage spikes.

Maximum Power Supply Current (ICC): 10 mA

A low maximum power supply current of 10 mA ensures power efficiency, making it suitable for battery-operated devices.

Technical Specifications

Multiplexer & Demultiplexer 74ALS251D attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

ALS

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Supply Current (ICC):

10 mA

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

74ALS251D Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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