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74ALVCH16260DLG4

Texas Instruments

74ALVCH16260DLG4 by Texas Instruments

The Texas Instruments 74ALVCH16260DLG4 is a 12-function multiplexer/demultiplexer with a supply voltage range of 1.65V to 3.6V and propagation delay of 5.6ns, suitable for industrial applications. It features a small outline package style, operates b/w -40°C to 85°C, and offers true output polarity with three-state characteristics.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,713 parts In-Stock

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Digiode

USA . 911 parts In-Stock

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911

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AZTECH Wire

Italy . 804 parts In-Stock

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$16.448

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Native Components

USA . 368 parts In-Stock

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$17.534

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Northwest PG Solutions

USA . 2,136 parts In-Stock

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$19.288

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$17.359

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Parana Technologies

USA . 2,099 parts In-Stock

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$20.387

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$20.417

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DigiPath Technology Company

USA . 984 parts In-Stock

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$22.449

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$20.653

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984

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ChromeModa Solutions

Germany . 2,893 parts In-Stock

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$22.907

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$18.784

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IDEA Electronic Components Group

UK . 1,892 parts In-Stock

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$20.616

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One Stop Electronics

USA . 784 parts In-Stock

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$48.000

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Corphita

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Overview

Experience unparalleled quality and reliability with Texas Instruments' 74ALVCH16260DLG4 Multiplexer & Demultiplexer. This versatile component offers 12 functions in a compact small outline package, making it ideal for a wide range of industrial applications. With a nominal supply voltage of 1.8V and a maximum operating temperature of 85°C, this product delivers exceptional performance and durability. Trust Texas Instruments to provide innovative solutions that meet your needs, giving you the edge in today's competitive market. Choose the 74ALVCH16260DLG4 for superior results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for applications that require portability and reliability.

Surface Mount: YES

The surface mount design allows for easy and efficient PCB assembly, saving time and cost during the manufacturing process.

No. of Functions: 12

With 12 functions in one device, this multiplexer/demultiplexer offers versatile and efficient signal routing capabilities.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low nominal supply voltage of 1.8V, making it suitable for power-sensitive applications and reducing energy consumption.

Propagation Delay (tpd): 5.6 ns

Fast propagation delay of 5.6 ns ensures quick signal processing and high-speed data transmission.

Maximum Operating Temperature: 85 °C

Capable of operating at a high temperature of 85°C, making it suitable for industrial environments with demanding temperature requirements.

Output Characteristics: 3-STATE

3-STATE output allows for high impedance state, providing flexibility in controlling the output signal and reducing power consumption.

Minimum Operating Temperature: -40 °C

Operates efficiently at low temperatures as low as -40°C, ensuring reliable performance even in harsh environmental conditions.

Technology: CMOS

Uses CMOS technology which offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Technical Specifications

Multiplexer & Demultiplexer 74ALVCH16260DLG4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

18.415 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

12

No. of Inputs:

1

No. of Outputs:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay (tpd):

5.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.49 mm

Trade Compliance

74ALVCH16260DLG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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