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74ALS251D-T

NXP Semiconductors

74ALS251D-T by NXP Semiconductors

74ALS251D-T by NXP Semiconductors is a TTL multiplexer with 8 inputs and a propagation delay of just 16 ns. It operates at a nominal voltage of 5V, featuring a compact SO package. Ideal for digital signal routing in commercial applications.

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3

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1k+

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Digiode

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Anansix

USA . 2,744 parts In-Stock

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Vyrian

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One Stop Electronics

USA . 263 parts In-Stock

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Native Components

USA . 493 parts In-Stock

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Northwest PG Solutions

USA . 219 parts In-Stock

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Corphita

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UNI Independent Distributors

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Overview

Unlock unparalleled versatility with the 74ALS251D-T from NXP Semiconductors, a trusted leader in innovative solutions. This high-quality multiplexer and demultiplexer effortlessly enhances your designs, enabling seamless data routing with minimal delay. Designed for efficiency and reliability, it thrives in diverse applications—from consumer electronics to industrial systems. Experience superior performance and dependability that empowers your projects and drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and strengthens the product while keeping it lightweight.

Surface Mount: YES

Surface mount capability allows for easier integration into compact designs, saving space on PCB layouts.

No. of Inputs: 8

With 8 inputs, this multiplexer/demultiplexer can efficiently handle multiple data lines, making it versatile for complex applications.

Package Shape: RECTANGULAR

The rectangular shape is standard, facilitating easy placement in various electronic designs.

Nominal Supply Voltage / Vsup: 5 V

Operating at a nominal voltage of 5V aligns well with common logic levels in digital circuits.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF ensures good signal integrity while minimizing power consumption.

No. of Terminals: 16

With 16 terminals, the design offers flexibility for connections, enhancing user convenience.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for high-density mounting on PCBs, making it perfect for space-constrained applications.

Propagation Delay (tpd): 16 ns

A propagation delay of 16 ns makes this device suitable for high-speed applications.

Maximum Operating Temperature: 70 °C

The maximum operating temperature of 70 °C ensures reliable performance in various environments without overheating.

Output Characteristics: 3-STATE

3-state output allows for better data management in bus systems, improving overall data handling efficiency.

Minimum Operating Temperature: 0 °C

This product can operate in temperatures as low as 0 °C, which makes it suitable for various environmental conditions.

Terminal Position: DUAL

Dual terminal positioning enhances flexibility when integrating into different circuit designs.

Maximum Seated Height: 1.75 mm

The low seated height of 1.75 mm is ideal for compact designs and minimizes profile, allowing for more efficient stacking.

Width: 3.9 mm

A compact width of 3.9 mm makes this product suitable for tight spaces on PCBs.

Output Polarity: COMPLEMENTARY

Complementary output polarity caters to diverse application needs and improves compatibility with other circuits.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5 V allows for operation with a broad range of supply voltages, enhancing versatility.

Length: 9.9 mm

The moderate length of 9.9 mm supports easy routing of interconnections on PCBs without taking excessive space.

Temperature Grade: COMMERCIAL

Commercial temperature grading indicates that the product is designed for general use, suitable for a variety of applications.

Technology: TTL

TTL technology provides faster switching speeds and lower power consumption, making it a reliable choice for digital circuits.

Terminal Form: GULL WING

Gull wing terminals enable better soldering and mechanical stability, ensuring reliable connections.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm facilitates compatibility with a variety of circuit board designs and layouts.

Maximum Supply Voltage (Vsup): 5.5 V

The product can tolerate a maximum supply voltage of 5.5 V, providing a margin for safety and reliability.

Maximum Power Supply Current (ICC): 10 mA

With a maximum supply current of 10 mA, the device is energy efficient, reducing overall system power consumption.

Technical Specifications

Multiplexer & Demultiplexer 74ALS251D-T attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

ALS

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Supply Current (ICC):

10 mA

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

74ALS251D-T Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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