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74ALS153D

NXP Semiconductors

74ALS153D by NXP Semiconductors

74ALS153D by NXP Semiconductors is a TTL multiplexer with 2 functions and 4 inputs, featuring a propagation delay of just 16 ns. It operates at a nominal voltage of 5V and supports temperatures from 0 °C to 70 °C. Ideal for compact electronic applications, it comes in a small outline package.

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Overview

Unlock the potential of your designs with the 74ALS153D from NXP Semiconductors, a leader in innovative electronic solutions. This high-quality multiplexer and demultiplexer enhances circuit flexibility and efficiency while ensuring reliable performance in diverse applications—from telecommunications to consumer electronics. With its compact design and robust features, the 74ALS153D delivers exceptional value, enabling you to optimize power consumption and streamline operations effortlessly. Choose NXP for unparalleled quality and support!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for a wide range of applications.

Surface Mount: YES

Being a surface mount device allows for a more compact design, making it ideal for space-constrained applications.

No. of Functions: 2

The dual-functionality provides versatility, allowing it to serve multiple purposes in a single package, thus saving space and resources.

No. of Inputs: 4

With four inputs, this multiplexer/demultiplexer can easily handle complex signal routing, making it suitable for various digital applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient PCB layout and assembly processes.

Nominal Supply Voltage / Vsup: 5V

Operating at a nominal supply voltage of 5V makes it compatible with standard digital electronics, ensuring easy integration.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF ensures high-speed operation while maintaining signal integrity, suitable for fast switching applications.

No. of Terminals: 16

Having 16 terminals allows for multiple connections, providing flexibility in design and application.

Package Style (Meter): SMALL OUTLINE

The small outline package style leads to less board space required for installation, which is crucial in modern compact devices.

Propagation Delay (tpd): 16 ns

A propagation delay of 16 ns ensures quick signal processing, making it suitable for high-speed communication systems.

Maximum Operating Temperature: 70 °C

Designed to operate at temperatures up to 70 °C, this product is suitable for a variety of environments without risk of failure.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, it guarantees functionality in standard operating conditions.

Terminal Position: DUAL

The dual terminal positioning enhances the efficiency of board layout and maximizes connectivity options.

Maximum Seated Height: 1.75 mm

A low maximum seated height contributes to a compact design, allowing for more efficient use of space on the PCB.

Width: 3.9 mm

A compact width of 3.9 mm facilitates dense packaging and reduces the footprint in multi-channel applications.

Output Polarity: TRUE

Having true output polarity ensures compatibility with standard logic levels in digital circuits.

Minimum Supply Voltage (Vsup): 4.5 V

With a minimum supply voltage of 4.5 V, the product offers operational flexibility while ensuring reliable performance.

Length: 9.9 mm

The length of 9.9 mm contributes to the overall compact size of the component, ideal for modern electronic designs.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates suitability for general consumer applications, ensuring reliable performance under typical conditions.

Technology: TTL

Utilizing TTL technology provides high-speed performance and increased noise immunity, making it a reliable choice for digital applications.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and improves mechanical stability on the PCB.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm provides a standard spacing for integration with existing PCB designs.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5 V, the product can accommodate slight variations in supply voltage without performance degradation.

Maximum Power Supply Current (ICC): 12 mA

The maximum power supply current of 12 mA indicates low power consumption, making it suitable for energy-efficient applications.

Technical Specifications

Multiplexer & Demultiplexer 74ALS153D attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

ALS

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Supply Current (ICC):

12 mA

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

74ALS153D Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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