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74ALVCH16271DGGRG4

Texas Instruments

74ALVCH16271DGGRG4 by Texas Instruments

Texas Instruments' 74ALVCH16271DGGRG4 is a CMOS multiplexer with 12 functions, operating at a supply voltage range of 1.65V to 3.6V. With a propagation delay of 6.2ns and output polarity as TRUE, it's ideal for industrial applications requiring high-speed data switching in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,517 parts In-Stock

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Digiode

USA . 4,985 parts In-Stock

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Native Components

USA . 442 parts In-Stock

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$1.171

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Northwest PG Solutions

USA . 632 parts In-Stock

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$1.288

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AZTECH Wire

Italy . 377 parts In-Stock

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$14.455

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Parana Technologies

USA . 2,270 parts In-Stock

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$17.140

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$17.354

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DigiPath Technology Company

USA . 898 parts In-Stock

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$18.873

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$17.363

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ChromeModa Solutions

Germany . 6,992 parts In-Stock

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$19.258

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$15.792

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IDEA Electronic Components Group

UK . 1,418 parts In-Stock

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$19.258

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$18.295

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$17.332

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One Stop Electronics

USA . 230 parts In-Stock

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$25.000

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Corphita

USA . 3,405 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the 74ALVCH16271DGGRG4 by Texas Instruments. Crafted with precision and expertise, this multiplexer & demultiplexer offers unparalleled performance and reliability for a wide range of applications. From industrial automation to telecommunications, this innovative product delivers unmatched value with its advanced features and capabilities. Trust in Texas Instruments to provide you with the quality and excellence you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

No. of Functions: 12

Allows for multiple inputs to be processed simultaneously, increasing efficiency and versatility.

Propagation Delay (tpd): 6.2 ns

Minimizes delay in signal transmission, enhancing the overall performance of the multiplexer/demultiplexer.

Output Characteristics: 3-STATE

Enables the output to be in one of three states: high, low, or high-impedance, providing flexibility in signal routing.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor technology, which offers low power consumption and high noise immunity.

Technical Specifications

Multiplexer & Demultiplexer 74ALVCH16271DGGRG4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

12

No. of Inputs:

1

No. of Outputs:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay (tpd):

6.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

74ALVCH16271DGGRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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