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74ALS251N

NXP Semiconductors

74ALS251N by NXP Semiconductors

74ALS251N by NXP Semiconductors is a TTL multiplexer with 8 inputs and a propagation delay of just 16 ns. It operates at a nominal voltage of 5V, supporting applications in data routing and signal processing. Its compact design features a dual terminal form factor for easy integration.

Median Price

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Lifecycle Status

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9

In-Stock Inventory

1k+

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Magnum Semiconductors LLP

India . 6,440 parts In-Stock

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Digiode

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Anansix

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R&J Components

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Hantronic-Components

Austria . 1,345 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 745 parts In-Stock

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Vyrian

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Quantum Digital Technology

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Legend Electronics Inc.

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Native Components

USA . 967 parts In-Stock

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Northwest PG Solutions

USA . 1,409 parts In-Stock

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One Stop Electronics

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Infinite Electronics LLP (Excess)

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UNI Independent Distributors

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Corphita

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RTC Component Inc.

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Overview

Unlock seamless connectivity and enhanced performance with the 74ALS251N from NXP Semiconductors. Renowned for their commitment to quality, NXP delivers reliable solutions tailored for diverse applications, from telecommunications to consumer electronics. This versatile multiplexer offers exceptional switching speeds and efficient operation, empowering your designs with superior functionality. Experience the advantages of innovation that drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material ensures durability and protection against environmental factors, making it suitable for various applications.

No. of Inputs: 8

With 8 inputs, this multiplexer/demultiplexer is capable of managing multiple data signals efficiently, enhancing versatility in circuit design.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCBs, making it ideal for compact electronic designs.

Nominal Supply Voltage / Vsup: 5 V

Operating at a nominal voltage of 5V ensures compatibility with common digital circuits, providing ease of integration.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF enables reliable signal switching speeds, increasing the overall performance in high-speed applications.

No. of Terminals: 16

With 16 terminals, this product offers extensive connectivity options, facilitating easy integration into larger systems.

Package Style (Meter): IN-LINE

The in-line package style allows for simpler PCB layout and easier handling during assembly.

Propagation Delay (tpd): 16 ns

A low propagation delay of 16 ns minimizes signal timing issues, making it suitable for high-speed data applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this component is capable of functioning in a variety of environments, enhancing reliability.

Output Characteristics: 3-STATE

The 3-state output allows for more efficient data management in digital systems, enabling multiple devices to share the same output line.

Minimum Operating Temperature: 0 °C

This device can operate from a minimum temperature of 0 °C, ensuring functionality in cooler environments.

Terminal Position: DUAL

Dual terminal positions allow for flexible mounting options, making it easier to design custom PCB layouts.

Maximum Seated Height: 4.2 mm

The compact seated height of 4.2 mm supports space-saving designs, crucial for modern electronic devices.

Width: 7.62 mm

A width of 7.62 mm enables dense placement on the PCB, optimizing space without sacrificing functionality.

Output Polarity: COMPLEMENTARY

Complementary output polarity supports various logic configurations, enhancing the flexibility of circuit designs.

Minimum Supply Voltage (Vsup): 4.5 V

This component can operate even at the low end of 4.5 V, providing flexibility in power supply options.

Length: 19.025 mm

A length of 19.025 mm ensures compatibility with standard PCB footprints, simplifying sourcing and PCB design.

Temperature Grade: COMMERCIAL

The commercial temperature grade confirms this device is suitable for a wide range of consumer applications.

Technology: TTL

Utilizing TTL technology allows for faster switching speeds and reduced power consumption, enhancing overall performance.

Terminal Form: THROUGH-HOLE

The through-hole terminal form strengthens mechanical stability while simplifying soldering for repairable designs.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is standard in many design applications, facilitating easier integration into existing systems.

Maximum Supply Voltage (Vsup): 5.5 V

This device can handle a maximum supply voltage of 5.5 V, allowing for a safety margin in power supply design.

Maximum Power Supply Current (ICC): 10 mA

The maximum supply current of 10 mA is energy-efficient, ensuring lower power consumption in battery-operated devices.

Technical Specifications

Multiplexer & Demultiplexer 74ALS251N attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

ALS

JESD-30 Code:

R-PDIP-T16

Length:

19.025 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

10 mA

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

74ALS251N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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