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74ALS153N

NXP Semiconductors

74ALS153N by NXP Semiconductors

74ALS153N by NXP Semiconductors is a TTL multiplexer/demultiplexer with 2 functions and 4 inputs. It operates at a nominal voltage of 5V, features a propagation delay of just 16 ns, and supports load capacitance up to 50 pF. Ideal for data routing in digital circuits, it ensures efficient signal management.

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Lifecycle Status

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9

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Vyrian

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LIBRA Elektronik GmbH

Germany . 1,686 parts In-Stock

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Digiode

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R&J Components

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Anansix

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ZD Integrated Circuits Inc.

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Electronic Expediters

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Extreme Components

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Mil-Aero Solutions, Inc.

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Northwest PG Solutions

USA . 746 parts In-Stock

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$2.977

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One Stop Electronics

USA . 647 parts In-Stock

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UNI Independent Distributors

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Corphita

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Glotronic Ltd.

UK . 2,780 parts In-Stock

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Kepictronics

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Native Components

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Overview

Unlock unparalleled performance with the 74ALS153N from NXP Semiconductors, a top-tier multiplexer and demultiplexer designed for high-speed applications. Experience the reliability and innovation that NXP is renowned for, ensuring your projects stand out. With its efficient design and robust functionality, this versatile component simplifies complex routing tasks while enhancing system performance, making it an essential choice for engineers seeking quality and dependability in their designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making it suitable for various applications.

No. of Functions: 2

With 2 functions, this multiplexer/demultiplexer offers versatility, allowing for multiple signal pathways in a compact form.

No. of Inputs: 4

Having 4 inputs enables flexible routing of signals, meeting the demands of complex circuit designs.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCB layouts, allowing for efficient integration into circuits.

Nominal Supply Voltage / Vsup: 5V

A nominal supply voltage of 5V is standard, ensuring compatibility with many digital systems and low power consumption.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF is low, which minimizes delays and enhances performance in high-speed applications.

No. of Terminals: 16

With 16 terminals, this component allows for strong connectivity options, supporting complex signal routing and easier integration.

Package Style (Meter): IN-LINE

The in-line package style facilitates easier assembly and integration into various circuit designs, enhancing manufacturing efficiency.

Propagation Delay (tpd): 16 ns

A propagation delay of 16 ns ensures rapid signal switching, making it suitable for high-speed digital applications.

Maximum Operating Temperature: 70 °C

The maximum operating temperature of 70 °C provides reliability in various environments, ensuring stable performance under thermal stress.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this product is adaptable for use in a wide range of environments, from standard to colder conditions.

Terminal Position: DUAL

The dual terminal position simplifies PCB design and facilitates easier routing of connections in tight spaces.

Maximum Seated Height: 4.2 mm

The low seated height of 4.2 mm allows for compact designs, saving valuable space on circuits.

Width: 7.62 mm

A width of 7.62 mm is compact, promoting space efficiency on PCBs while allowing for dense component placement.

Output Polarity: TRUE

The true output polarity indicates straightforward logic levels, simplifying design and integration in digital circuits.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5 V ensures flexibility in power supply options, making it suitable for various applications.

Length: 19.025 mm

The length of 19.025 mm contributes to a compact design, allowing for high density in electronic layouts.

Temperature Grade: COMMERCIAL

Commercial temperature grade makes this product appropriate for general-purpose usage while ensuring reliability.

Technology: TTL

Using TTL technology enhances speed and integration capabilities, making it suitable for modern digital applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical stability and ease of soldering, beneficial for prototyping and robust designs.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is standard and widely compatible, facilitating integration with various circuit designs.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V offers a wide operating range, enhancing circuit flexibility and compatibility.

Maximum Power Supply Current (ICC): 12 mA

With a maximum power supply current of 12 mA, it ensures low power consumption and efficiency in power-sensitive applications.

Technical Specifications

Multiplexer & Demultiplexer 74ALS153N attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

ALS

JESD-30 Code:

R-PDIP-T16

Length:

19.025 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

12 mA

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

74ALS153N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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