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66AK2H12BAAWA24

Texas Instruments

66AK2H12BAAWA24 by Texas Instruments

The Texas Instruments 66AK2H12BAAWA24 microprocessor features a 64-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for applications requiring high-speed processing and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,800 parts In-Stock

1+ parts

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8,800

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Digiode

USA . 490 parts In-Stock

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-

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490

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 977 parts In-Stock

1+ parts

$4.000

100+ parts

-

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977

$4.000

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AZTECH Wire

Italy . 678 parts In-Stock

1+ parts

$10.137

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678

$10.137

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Native Components

USA . 598 parts In-Stock

1+ parts

$22.764

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-

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598

$22.764

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Northwest PG Solutions

USA . 1,517 parts In-Stock

1+ parts

$25.040

100+ parts

$22.536

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1,517

$25.040

$22.536

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Parana Technologies

USA . 1,586 parts In-Stock

1+ parts

$29.172

100+ parts

-

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$56.356

10k+ parts

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1,586

$29.172

-

$56.356

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DigiPath Technology Company

USA . 1,252 parts In-Stock

1+ parts

$32.121

100+ parts

$29.552

1k+ parts

-

10k+ parts

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1,252

$32.121

$29.552

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ChromeModa Solutions

Germany . 6,170 parts In-Stock

1+ parts

$32.777

100+ parts

$26.877

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6,170

$32.777

$26.877

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IDEA Electronic Components Group

UK . 817 parts In-Stock

1+ parts

$32.777

100+ parts

$31.138

1k+ parts

$29.499

10k+ parts

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817

$32.777

$31.138

$29.499

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Corphita

USA . 2,544 parts In-Stock

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2,544

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Microchip USA

USA . 1,725 parts In-Stock

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1,725

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Overview

Experience the cutting-edge technology of the Texas Instruments 66AK2H12BAAWA24 microprocessor, a powerhouse in the world of digital processing. With a reputation for high-quality manufacturing, Texas Instruments delivers top-of-the-line products that push boundaries and exceed expectations. Ideal for a wide range of applications, this microprocessor offers unparalleled performance and reliability. Unlock the potential of your projects with the exceptional value, benefits, and advantages that the 66AK2H12BAAWA24 brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product easier to handle and less prone to damage during shipping and handling.

Integrated Cache: YES

Having integrated cache enhances the processing speed and efficiency of the microprocessor, allowing for quicker access to frequently used data and instructions.

Terminal Finish: TIN SILVER COPPER

This finish provides good conductivity, corrosion resistance, and solderability, ensuring reliable connections and optimal performance of the microprocessor.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with a wide range of devices, making the microprocessor energy-efficient and versatile.

Speed: 1400 rpm

The high speed of 1400 rpm enables fast data processing and multitasking capabilities, making the microprocessor suitable for demanding applications that require quick response times.

Technical Specifications

Microprocessors 66AK2H12BAAWA24 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1517

JESD-609 Code:

e1

Length:

40 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.75 mm

Speed:

1400 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

40 mm

Peripheral IC Type:

Trade Compliance

66AK2H12BAAWA24 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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