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66AK2H06AAAWA2

Texas Instruments

66AK2H06AAAWA2 by Texas Instruments

The Texas Instruments 66AK2H06AAAWA2 microprocessor features a 24-bit address bus, 16-bit external data bus, and max clock frequency of 156.25 MHz. Ideal for applications requiring high-speed processing and low power consumption in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,514 parts In-Stock

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2,514

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Vyrian

USA . 338 parts In-Stock

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338

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Distributors (Availability)

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Native Components

USA . 890 parts In-Stock

1+ parts

$12.676

100+ parts

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890

$12.676

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Northwest PG Solutions

USA . 139 parts In-Stock

1+ parts

$13.944

100+ parts

$12.549

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139

$13.944

$12.549

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AZTECH Wire

Italy . 238 parts In-Stock

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$17.040

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238

$17.040

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One Stop Electronics

USA . 1,529 parts In-Stock

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$23.000

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1,529

$23.000

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Parana Technologies

USA . 132 parts In-Stock

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$72.386

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132

$72.386

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DigiPath Technology Company

USA . 1,870 parts In-Stock

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$79.706

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$73.330

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1,870

$79.706

$73.330

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IDEA Electronic Components Group

UK . 2,194 parts In-Stock

1+ parts

$81.333

100+ parts

$77.266

1k+ parts

$73.200

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2,194

$81.333

$77.266

$73.200

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ChromeModa Solutions

Germany . 1,425 parts In-Stock

1+ parts

$81.333

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$66.693

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1,425

$81.333

$66.693

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QUARKTWIN TECHNOLOGY LTD

USA . 27,981 parts In-Stock

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27,981

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Corphita

USA . 2,823 parts In-Stock

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2,823

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Microchip USA

USA . 155 parts In-Stock

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155

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Overview

Unleash the power of innovation with the Texas Instruments 66AK2H06AAAWA2 microprocessor! Crafted by a renowned manufacturer, this cutting-edge device boasts integrated cache, fast clock frequency, and low power mode, making it ideal for a wide range of applications. From enhancing performance in automotive systems to revolutionizing industrial automation, this microprocessor delivers unparalleled value, efficiency, and reliability. Elevate your projects to new heights with the unmatched quality and advanced features of the 66AK2H06AAAWA2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material is durable and lightweight, making the microprocessor easy to handle and install.

Integrated Cache: YES

Having an integrated cache improves the overall performance of the microprocessor by allowing for faster access to frequently used data.

Surface Mount: YES

Being surface mountable enables easy and efficient installation of the microprocessor onto circuit boards, saving space and facilitating assembly.

Maximum Supply Voltage: 1.05 V

The maximum supply voltage of 1.05 V ensures safe operation and prevents damage to the microprocessor from overvoltage.

Address Bus Width: 24

A wider address bus width of 24 allows for larger memory addressing capabilities, increasing the versatility and processing power of the microprocessor.

Package Shape: SQUARE

The square package shape is compact and helps maximize space utilization on circuit boards, making the microprocessor suitable for small form factor devices.

No. of Terminals: 1517

With 1517 terminals, the microprocessor offers a high level of connectivity options for interfacing with other components and peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style provides a reliable connection between the microprocessor and the circuit board, ensuring stable operation even under challenging conditions.

Minimum Supply Voltage: 0.95 V

The minimum supply voltage of 0.95 V allows for efficient power management and lower energy consumption, making the microprocessor more energy-efficient.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring reliable performance and longevity of the microprocessor.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies the soldering process and ensures a secure connection between the microprocessor and the circuit board.

Maximum Seated Height: 3.75 mm

The low maximum seated height of 3.75 mm allows for a slim profile and facilitates the integration of the microprocessor into compact devices with limited space.

Width: 40 mm

The width of 40 mm provides a balance between compactness and connectivity, making the microprocessor versatile and suitable for a wide range of applications.

Boundary Scan: YES

Having boundary scan capability allows for efficient testing and debugging of the microprocessor, ensuring high quality and reliability of the final product.

External Data Bus Width: 16

The external data bus width of 16 enables fast data transfer between the microprocessor and external devices, improving overall performance and efficiency.

Maximum Clock Frequency: 156.25 MHz

The high maximum clock frequency of 156.25 MHz allows the microprocessor to handle complex calculations and processes quickly, enhancing overall performance.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature ensures proper soldering and connection of the microprocessor during assembly, enhancing reliability.

Peak Reflow Temperature °C: 245

The peak reflow temperature of 245°C enables efficient and reliable soldering of the microprocessor onto circuit boards, ensuring a solid connection.

Length: 40 mm

The length of 40 mm provides a balanced form factor that is suitable for various applications, making the microprocessor versatile and easy to integrate.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor, it offers simplified instruction sets and faster execution, making it ideal for high-performance computing and energy-efficient devices.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the microprocessor energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

Having ball terminals facilitates easy soldering and provides a reliable connection between the microprocessor and the circuit board, ensuring stable operation.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1 V ensures optimal performance and energy efficiency, making the microprocessor suitable for a wide range of applications.

Terminal Pitch: 1 mm

The terminal pitch of 1 mm provides a good balance between connectivity and space efficiency, making the microprocessor versatile and easy to integrate.

Format: FLOATING POINT

Being a floating point format microprocessor allows for high precision calculations and processing of complex numerical data, making it suitable for scientific and mathematical applications.

Moisture Sensitivity Level (MSL): 4

Having a moisture sensitivity level of 4 indicates that the microprocessor is resistant to moisture damage, ensuring reliable performance even in humid environments.

Speed: 1200 rpm

With a speed of 1200 rpm, the microprocessor offers fast and efficient processing, enabling quick execution of tasks and high performance in demanding applications.

Low Power Mode: YES

The low power mode feature allows the microprocessor to conserve energy and extend battery life, making it ideal for portable devices and energy-efficient applications.

Technical Specifications

Microprocessors 66AK2H06AAAWA2 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

24

Boundary Scan:

YES

Maximum Clock Frequency:

156.25 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1517

JESD-609 Code:

e1

Length:

40 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.75 mm

Speed:

1200 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

40 mm

Peripheral IC Type:

Trade Compliance

66AK2H06AAAWA2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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