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66AK2E05DABDA4

Texas Instruments

66AK2E05DABDA4 by Texas Instruments

The Texas Instruments 66AK2E05DABDA4 microprocessor features integrated cache, 16-bit address bus width, and a max supply voltage of 1.05V. Ideal for applications requiring high-speed processing in compact spaces with its square package shape and grid array style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,943 parts In-Stock

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Digiode

USA . 169 parts In-Stock

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169

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Distributors (Availability)

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AZTECH Wire

Italy . 439 parts In-Stock

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$9.977

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439

$9.977

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Native Components

USA . 425 parts In-Stock

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$12.580

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425

$12.580

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One Stop Electronics

USA . 1,038 parts In-Stock

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$13.000

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$13.000

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Northwest PG Solutions

USA . 1,200 parts In-Stock

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$13.838

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$12.454

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1,200

$13.838

$12.454

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Parana Technologies

USA . 91 parts In-Stock

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$48.819

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91

$48.819

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DigiPath Technology Company

USA . 1,412 parts In-Stock

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$53.756

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$53.756

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ChromeModa Solutions

Germany . 3,427 parts In-Stock

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$54.853

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$44.979

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3,427

$54.853

$44.979

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IDEA Electronic Components Group

UK . 2,002 parts In-Stock

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$54.853

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$52.110

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$49.368

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$49.368

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Corphita

USA . 2,336 parts In-Stock

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Overview

Enhance your electronic designs with the 66AK2E05DABDA4 microprocessor from Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology in the form of this innovative microprocessor. Ideal for a wide range of applications, this microprocessor offers unmatched performance and efficiency. Unlock the full potential of your projects with the value and benefits that the 66AK2E05DABDA4 brings to the table. Trust Texas Instruments to provide you with the tools you need to succeed in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes the microprocessor lightweight and durable, ideal for portable electronic devices.

Integrated Cache: YES

Having an integrated cache improves the overall performance of the microprocessor by allowing for faster access to frequently used data and instructions.

Surface Mount: YES

Being surface mountable simplifies the manufacturing process and allows for easy installation onto circuit boards, saving time and effort.

Maximum Supply Voltage: 1.05 V

The low maximum supply voltage of 1.05 V helps in reducing power consumption and heat generation, leading to better energy efficiency.

Address Bus Width: 16

With a wider address bus width of 16, the microprocessor can handle larger amounts of memory and data, making it suitable for multitasking and complex computations.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board, enabling a compact design for devices with limited space.

No. of Terminals: 1089

Having a high number of terminals provides more connectivity options and interfaces, making the microprocessor versatile and compatible with various components.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array fine pitch package style offers precise and reliable connections, ensuring optimal performance and signal integrity in complex electronic systems.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage of 0.95 V allows for flexible power management and voltage scaling, enabling the microprocessor to operate efficiently in different power scenarios.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies the assembly process and improves thermal management, enhancing overall reliability and performance.

Maximum Seated Height: 3.55 mm

The maximum seated height of 3.55 mm ensures compatibility with slim and compact device designs, making it suitable for applications with space constraints.

Width: 27 mm

The narrow width of 27 mm allows for a streamlined and space-efficient layout on a circuit board, contributing to a more compact and sleek device design.

Boundary Scan: YES

Having boundary scan capability simplifies testing, debugging, and maintenance of the microprocessor, improving overall reliability and ease of use.

External Data Bus Width: 16

With an external data bus width of 16, the microprocessor can efficiently transfer data to and from external devices, enabling high-speed data processing and communication.

Length: 27 mm

The short length of 27 mm contributes to a compact form factor, making the microprocessor suitable for space-constrained applications without compromising performance.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor with peripheral IC functionality allows for efficient execution of instructions and processing of data, enhancing overall performance and speed.

Technology: CMOS

The CMOS technology used in the microprocessor offers low power consumption, high speed, and reliable operation, making it a cost-effective and efficient choice for various applications.

Terminal Form: BALL

Having ball terminals facilitates easy and reliable soldering connections, ensuring secure attachment to a circuit board and improving overall durability and performance.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1 V provides a stable operating voltage for the microprocessor, ensuring consistent performance and reliability under varying load conditions.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8 mm allows for high-density mounting and efficient use of space on a circuit board, enabling the integration of more components for advanced functionality.

Format: FLOATING POINT

Supporting floating-point operations enhances the microprocessor's ability to perform complex mathematical calculations with precision and efficiency, making it ideal for scientific and computational applications.

Speed: 1400 rpm

With a speed of 1400 rpm, the microprocessor offers fast processing capabilities, enabling quick data manipulation and response times for seamless user experience.

Low Power Mode: YES

Having a low power mode allows the microprocessor to conserve energy and extend battery life in portable devices, making it an energy-efficient and eco-friendly choice.

Technical Specifications

Microprocessors 66AK2E05DABDA4 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1089

Length:

27 mm

Low Power Mode:

YES

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Maximum Seated Height:

3.55 mm

Speed:

1400 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

66AK2E05DABDA4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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