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66AK2H06BAAW2

Texas Instruments

66AK2H06BAAW2 by Texas Instruments

The Texas Instruments 66AK2H06BAAW2 microprocessor features a 64-bit external data bus width, integrated cache, and operates at a speed of 1200 rpm. It is commonly used in applications requiring high processing power and low power consumption, such as embedded systems and networking devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,448 parts In-Stock

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7,448

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Digiode

USA . 2,362 parts In-Stock

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2,362

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,196 parts In-Stock

1+ parts

$2.000

100+ parts

-

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1,196

$2.000

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AZTECH Wire

Italy . 326 parts In-Stock

1+ parts

$9.376

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-

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326

$9.376

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Parana Technologies

USA . 1,901 parts In-Stock

1+ parts

$24.530

100+ parts

-

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$25.196

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1,901

$24.530

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$25.196

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DigiPath Technology Company

USA . 1,501 parts In-Stock

1+ parts

$27.011

100+ parts

$24.850

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-

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1,501

$27.011

$24.850

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ChromeModa Solutions

Germany . 5,389 parts In-Stock

1+ parts

$27.562

100+ parts

$22.601

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-

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5,389

$27.562

$22.601

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IDEA Electronic Components Group

UK . 1,402 parts In-Stock

1+ parts

$27.562

100+ parts

$26.184

1k+ parts

$24.806

10k+ parts

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1,402

$27.562

$26.184

$24.806

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One Stop Electronics

USA . 692 parts In-Stock

1+ parts

$35.000

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692

$35.000

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Microchip USA

USA . 2,603 parts In-Stock

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2,603

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Corphita

USA . 914 parts In-Stock

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914

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Native Components

USA . 423 parts In-Stock

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423

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Perfect Parts

USA . 259 parts In-Stock

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259

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Northwest PG Solutions

USA . 255 parts In-Stock

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255

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Overview

Experience unmatched performance and reliability with the Texas Instruments 66AK2H06BAAW2 microprocessor. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and cutting-edge technology. This versatile product is perfect for a wide range of applications, offering customers unparalleled value and benefits. Trust Texas Instruments to provide you with the innovative solutions you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Integrated Cache: YES

Having integrated cache helps improve the overall performance of the microprocessor by reducing latency in accessing commonly used data.

Surface Mount: YES

Surface mount technology allows for a compact design, making the product suitable for devices with limited space.

Maximum Supply Voltage: 1.05 V

Operating within this voltage range ensures efficient power consumption and helps prevent damage to the microprocessor.

Address Bus Width: 16

A wider address bus allows the processor to access a larger range of memory locations, enhancing its capability to handle complex tasks.

Package Shape: SQUARE

The square shape of the package provides a symmetric and efficient layout for mounting on circuit boards.

No. of Terminals: 1517

Having a high number of terminals allows for a greater level of connectivity and functionality within the microprocessor.

Minimum Supply Voltage: 0.95 V

Operating at a low minimum voltage helps in reducing power consumption and heat generation, leading to improved energy efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows the microprocessor to perform reliably even under demanding conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the microprocessor can function in a wide range of environments, including extreme cold.

Terminal Finish: TIN SILVER COPPER

This finish provides excellent conductivity and corrosion resistance, ensuring reliable connections between the microprocessor and external components.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure mounting on circuit boards, enhancing the overall durability of the product.

Maximum Seated Height: 3.75 mm

The compact height of the microprocessor allows for space-saving installation in various electronic devices.

Width: 40 mm

The compact width of the microprocessor makes it suitable for integration into small form factor devices.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the microprocessor during the manufacturing process, ensuring high quality and reliability.

External Data Bus Width: 64

The wide external data bus allows for high-speed data transfer between the microprocessor and other components, enhancing overall performance.

Peak Reflow Temperature: 245 °C

The high peak reflow temperature ensures reliable soldering during the manufacturing process, resulting in robust connections and durability.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor type, it offers high performance, energy efficiency, and simplified instruction set for faster execution of tasks.

Technology: CMOS

CMOS technology allows for low power consumption and high-speed operation, making the microprocessor suitable for a wide range of applications.

Terminal Form: BALL

Having ball terminals provides secure and reliable connections, ensuring stable performance of the microprocessor in various operating conditions.

Nominal Supply Voltage: 1 V

Operating at a nominal voltage of 1 V helps maintain stable performance and energy efficiency in the microprocessor.

Terminal Pitch: 1 mm

The small terminal pitch allows for compact and efficient design of the microprocessor, making it suitable for space-constrained applications.

Format: FLOATING POINT

Support for floating-point operations enables the microprocessor to handle complex arithmetic calculations with precision, making it suitable for scientific and computing applications.

Moisture Sensitivity Level (MSL): 4

Having a moderate moisture sensitivity level of 4 ensures that the microprocessor can withstand typical storage and handling conditions without degradation.

Speed: 1200 rpm

Operating at a speed of 1200 rpm allows for fast and efficient processing of data, making the microprocessor suitable for high-performance computing tasks.

Low Power Mode: YES

Support for low power mode helps in reducing energy consumption during idle or low-intensity operations, making the microprocessor more energy-efficient.

Technical Specifications

Microprocessors 66AK2H06BAAW2 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1517

JESD-609 Code:

e1

Length:

40 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.75 mm

Speed:

1200 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

40 mm

Peripheral IC Type:

Trade Compliance

66AK2H06BAAW2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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