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54ACT11181J

Texas Instruments

54ACT11181J by Texas Instruments

54ACT11181J by Texas Instruments is a CMOS digital arithmetic circuit with 28 terminals and a supply voltage of 5V. It operates in temperatures ranging from -55°C to 125°C, making it suitable for military-grade applications requiring high reliability and performance. The package style is in-line rectangular ceramic, ideal for through-hole mounting in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,379 parts In-Stock

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Digiode

USA . 1,016 parts In-Stock

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1,016

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Distributors (Availability)

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Northwest PG Solutions

USA . 1,039 parts In-Stock

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$2.542

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$2.542

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AZTECH Wire

Italy . 884 parts In-Stock

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$17.075

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Parana Technologies

USA . 706 parts In-Stock

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$26.613

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$27.176

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706

$26.613

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IDEA Electronic Components Group

UK . 577 parts In-Stock

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$29.902

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$28.407

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$26.912

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577

$29.902

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ChromeModa Solutions

Germany . 181 parts In-Stock

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$29.902

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$24.520

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One Stop Electronics

USA . 858 parts In-Stock

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$56.000

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Corphita

USA . 2,476 parts In-Stock

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DigiPath Technology Company

USA . 1,566 parts In-Stock

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$26.960

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Native Components

USA . 624 parts In-Stock

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Overview

Discover the superior quality and reliability of the 54ACT11181J by Texas Instruments, a leading manufacturer in the industry. This digital arithmetic circuit offers unparalleled performance and precision, making it ideal for a wide range of applications. Whether you're designing high-tech military equipment or advanced industrial machinery, this product delivers exceptional value, benefits, and advantages that will exceed your expectations. Trust Texas Instruments to provide cutting-edge technology that empowers your projects to reach new heights of success. Choose the 54ACT11181J for unbeatable quality and performance.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent heat dissipation and mechanical protection, making this product suitable for high-reliability and high-performance applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V allows for compatibility with common power sources and ensures stability in voltage-sensitive applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand elevated temperatures without compromising performance, making it suitable for harsh environments.

Technology: CMOS

Using CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making this product energy-efficient and versatile.

Technical Specifications

Digital Arithmetic Circuits 54ACT11181J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T28

Logic IC Type:

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

54ACT11181J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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