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54AC11881JT

Texas Instruments

54AC11881JT by Texas Instruments

54AC11881JT by Texas Instruments is a 4-bit digital arithmetic circuit with a supply voltage of 5V, suitable for military-grade applications. It features CMOS technology, operates b/w -55 to 125°C, and has a package style of IN-LINE. With 28 terminals and through-hole terminal form, it offers reliable performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,675 parts In-Stock

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Vyrian

USA . 3,131 parts In-Stock

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Andel Nordic

Denmark . 172 parts In-Stock

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$7.644

100+ parts

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$7.338

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$7.338

172

$7.644

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$7.338

$7.338

One Stop Electronics

USA . 489 parts In-Stock

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$9.000

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489

$9.000

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AZTECH Wire

Italy . 440 parts In-Stock

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$15.511

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$15.511

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Parana Technologies

USA . 1,125 parts In-Stock

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$18.217

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$18.353

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DigiPath Technology Company

USA . 2,028 parts In-Stock

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$20.059

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$20.059

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ChromeModa Solutions

Germany . 4,624 parts In-Stock

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$20.468

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$16.784

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$20.468

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IDEA Electronic Components Group

UK . 1,549 parts In-Stock

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$20.468

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$19.445

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$18.421

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Corphita

USA . 4,599 parts In-Stock

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Northwest PG Solutions

USA . 1,184 parts In-Stock

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Native Components

USA . 975 parts In-Stock

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Overview

Elevate your digital arithmetic circuits with the 54AC11881JT by Texas Instruments. Crafted with precision and reliability in mind, this rectangular-shaped module boasts a package body material of ceramic, ensuring top-notch quality for your applications. With its 4-bit capacity and dual terminal position, this military-grade technology offers unparalleled performance in a compact design. Trust Texas Instruments to deliver excellence in every detail, providing you with the value and benefits you need to excel in your projects. Upgrade your circuits today and experience the difference with the 54AC11881JT.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed material ensures durability and reliability, making this product suitable for harsh environments.

No. of Bits: 4

With 4 bits, this digital arithmetic circuit can perform basic arithmetic operations efficiently.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V provides stable performance and compatibility with standard voltage levels.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes this product suitable for applications where temperature fluctuations are common.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high speed, and compatibility with various digital systems.

Technical Specifications

Digital Arithmetic Circuits 54AC11881JT attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS

Family:

AC

JESD-30 Code:

R-GDIP-T28

Length:

36.83 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP28,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

54AC11881JT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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